2018
DOI: 10.1016/j.electacta.2018.04.087
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Electrochemically prepared oxides for resistive switching devices

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Cited by 29 publications
(25 citation statements)
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“…With this method, the composition, thickness, and structure can be controlled by choosing an appropriate substrate, electrolyte, and electrochemical conditions. Only a few studies have addressed this method of fabricating TiO 2 -based memristors (Miller et al, 2010 ; Yoo et al, 2013 ; Aglieri et al, 2018 ; Zaffora et al, 2018 ). Recently, promising advances in anodizing to form a compact topology of memristors (8–29 nm thickness and 4 μm 2 feature area) have been demonstrated (Aglieri et al, 2018 ).…”
Section: Synthesis and Fabricationmentioning
confidence: 99%
“…With this method, the composition, thickness, and structure can be controlled by choosing an appropriate substrate, electrolyte, and electrochemical conditions. Only a few studies have addressed this method of fabricating TiO 2 -based memristors (Miller et al, 2010 ; Yoo et al, 2013 ; Aglieri et al, 2018 ; Zaffora et al, 2018 ). Recently, promising advances in anodizing to form a compact topology of memristors (8–29 nm thickness and 4 μm 2 feature area) have been demonstrated (Aglieri et al, 2018 ).…”
Section: Synthesis and Fabricationmentioning
confidence: 99%
“…In contrast, the set and reset processes of the bipolar resistive type occur via the opposite polarity of the electric field. Among the many resistive switching materials, metal oxides are the most popular, owing to their good stability, reproducibility, and repeatability [4][5][6][7][8][9][10][11][12][13][14][15][16][17]. Representative metal oxide-based resistive random access memory (RRAM) materials include TaO x , TiO 2 , Al 2 O 3 , and HfO 2 [4][5][6][7][8][9][10][11][12][13][14][15][16][17], with different configurations like anodic oxidation and physical vapor deposition (PVD), and chemical vapor deposition (CVD).…”
Section: Introductionmentioning
confidence: 99%
“…Among the many resistive switching materials, metal oxides are the most popular, owing to their good stability, reproducibility, and repeatability [4][5][6][7][8][9][10][11][12][13][14][15][16][17]. Representative metal oxide-based resistive random access memory (RRAM) materials include TaO x , TiO 2 , Al 2 O 3 , and HfO 2 [4][5][6][7][8][9][10][11][12][13][14][15][16][17], with different configurations like anodic oxidation and physical vapor deposition (PVD), and chemical vapor deposition (CVD). It is worth noting that a bilayer stack of metal oxide exhibits relatively better resistive switching performance, such as endurance, retention, and variability performance, compared with a single-layer stack [18][19][20][21][22].…”
Section: Introductionmentioning
confidence: 99%
“…For the active layers, many different material candidates have been investigated such as TiO 2 , HfO 2 , NbO 2 , TaO x , ZnO and Al 2 O 3 [11][12][13][14][15]. Also, for the formation of oxide active layers, deposition methods such as sputtering and anodizing have been utilized [16][17][18][19]. Among the candidate materials, TiO 2 -or TiO 2 /TiO 2-x -based memristors have been intensively studied since the physical realization and understanding of the memristors in 2008 [20].…”
Section: Introductionmentioning
confidence: 99%