Electrochemical study of titanium nitride films obtained by reactive sputtering

Massiani, Y.; Medjahed, Aïcha; Gravier, P.; Argeme, L.; Fedrizzi, L.

doi:10.1016/0040-6090(90)90382-n

Cited by 77 publications

(11 citation statements)

References 17 publications

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“…4b). Although Massiani et al 5 showed that there was no attack on TiN films in the corrosion potential, a chemical surface analysis should be done in order to know the exact chemical composition of this layer.…”

Section: Resultsmentioning

confidence: 99%

“…The use of hard coatings/steel substrates systems in mechanical applications performed under aggressive environmental conditions brought about an important point of discussion, since despite its tribological properties, a thin hard coating must also be able to improve the corrosion resistance of the substrate material used. Although the films used as hard coatings are generally chemically inert [5][6][7] , their use as corrosion barriers is often unsatisfactory. Since the deposition processes usually generate many small pores and pinholes 8,9 , the electrochemical behavior of a hard coating/substrate system depends mainly on the extent of these defects.…”

Section: Introductionmentioning

confidence: 99%

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Comparative study between the electrochemical behavior of TiN, TiCxNy and CrN hard coatings by using microscopy and electrochemical techniques

et al. 2001

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Hard thin TiN, TiCxNy and CrN films deposited by Physical Vapor Deposition (PVD) techniques onto steel substrates were immersed in an aggressive environment and evaluated by Atomic Force Microscopy (AFM) and Electrochemical Impedance Spectroscopy (EIS). The mechanical and electrochemical behavior, as well as the microstructure of TiCxNy depended directly on the contents of carbon and nitrogen in the coating. The best results were obtained with stoichiometric coatings that are presented in this work. Although a small amount of pinholes could be observed, the electrochemical performance of TiN film was poorer than the stoichiometric TiCxNy coating. However, the CrN films showed the highest initial and residual corrosion resistance values, probably due to their dense structure

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Comparative study between the electrochemical behavior of TiN, TiCxNy and CrN hard coatings by using microscopy and electrochemical techniques

et al. 2001

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“…13 The stiffness of the unloading curves was measured after five loading-unloading cycles to avoid the plastic deformation component. [15][16][17] This is probably due to the presence of micropores through which the chlorine ions can reach the substrate. In Figs.…”

Section: Resultsmentioning

confidence: 99%

Dependence of the mechanical and structural properties of (Ti,Al)N films on the nitrogen content

et al. 1999

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Ti,Al)N films with increasing nitrogen content were grown by reactive cosputtering and characterized by auger electron spectroscopy, grazing x-ray diffraction, polarization curves, electrochemical impedance spectroscopy, nanoindentation, and atomic force microscopy. For Ti/Al ≈ 1 the Ti 1−x Al x N phase is always present, but lower nitrogen contents lead to an additional phase, probably ␣-Ti(Al), which causes a decrease in hardness and Young's modulus. The increase of nitrogen content results in a decrease of surface roughness or a more compacted surface coating, according to the impedance results.

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“…It has been reported that TiN films with more than 200 nm thickness were not mechanically stable on glass substrates and peeled-off up with time on account of stress *Author for correspondence (rjayafmt@iitr.ernet.in) (Massiani et al 1990). It is very essential to prepare mechanically stable thick TiN films on glass substrate and also measure its mechanical properties.…”

Section: Introductionmentioning

confidence: 99%

Microstructural characteristics and mechanical properties of magnetron sputtered nanocrystalline TiN films on glass substrate

2009

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Nanocrystalline TiN thin films were deposited on glass substrate by d.c. magnetron sputtering. The microstructural characteristics of the thin films were characterized by XRD, FE-SEM and AFM. XRD analysis of the thin films, with increasing thickness, showed the (200) preferred orientation up to 1⋅26 μm thickness and then it transformed into (220) and (200) peaks with further increase in thickness up to 2⋅83 μm. The variation in preferred orientation was due to the competition between surface energy and strain energy during film growth. The deposited films were found to be very dense nanocrystalline film with less porosity as evident from their FE-SEM and AFM images. The surface roughness of the TiN films has increased slightly with the film thickness as observed from its AFM images. The mechanical properties of TiN films such as hardness and modulus of elasticity (E) were investigated by nanoindentation technique. The hardness of TiN thin film was found to be thickness dependent. The highest hardness value (24 GPa) was observed for the TiN thin films with less positive micro strain.

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Electrochemical study of titanium nitride films obtained by reactive sputtering

Cited by 77 publications

References 17 publications

Comparative study between the electrochemical behavior of TiN, TiCxNy and CrN hard coatings by using microscopy and electrochemical techniques

Comparative study between the electrochemical behavior of TiN, TiCxNy and CrN hard coatings by using microscopy and electrochemical techniques

Dependence of the mechanical and structural properties of (Ti,Al)N films on the nitrogen content

Microstructural characteristics and mechanical properties of magnetron sputtered nanocrystalline TiN films on glass substrate

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