Electrochemical Study of the Gold Thiosulfate Reduction

Sullivan, Anne; Kohl, Paul A.

doi:10.1149/1.1837660

Cited by 53 publications

(36 citation statements)

References 9 publications

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“…Electrowinning is also an option for gold recovery, and [Au(S 2 O 3 ) 2 ] 3− anions in the pregnant solutions will migrate to the cathode, being reduced to metallic gold [64][65][66][67]. However, it is also not a feasible choice because undesirable reactions of other anions including copper (I) thiosulfate complexes, sulfur-oxygen anions and other metal thiosulfate complexes in the solutions can occur on the electrode surface.…”

Section: High Requirements On the Solution Ph Values Resin Adsorptionmentioning

confidence: 99%

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Recovery of Gold from Pregnant Thiosulfate Solutions by the Resin Adsorption Technique

Dong

Jiang

et al. 2017

Metals

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This review is devoted to an integrated evaluation of the current use and future development of the resin adsorption technique in gold recovery from pregnant thiosulfate solutions.Comparisons are firstly made with other recovery techniques, including precipitation, activated carbon adsorption, solvent extraction, electrowinning and mesoporous silica adsorption. A detailed discussion about the recent advances of the technique in gold recovery from pregnant thiosulfate solutions is then presented from the aspects of gold adsorption on the resins and gold-loaded resin elution, respectively. On the basis of summarizing the present research, the major limitations of the resin adsorption technique are eventually pointed out and future development will also be prospected.

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Section: High Requirements On the Solution Ph Values Resin Adsorptionmentioning

confidence: 99%

“…Ammonia-free thiosulfate leaching process by Barrick Gold Corporation to treat a carbonbearing sulfide gold ore pretreated with acidic or alkaline pressure oxidation [4,5]. [64][65][66][67] Low current efficiency and high energy consumption due to the undesirable reactions Difficulty in cyclic utilization of pregnant thiosulfate solutions…”

Section: Introductionmentioning

confidence: 99%

Recovery of Gold from Pregnant Thiosulfate Solutions by the Resin Adsorption Technique

Dong

Jiang

et al. 2017

Metals

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“…The hemispherical bulges/bubbles formation in the annealed gold film is related to the incorporation of impurities such as hydrogen gas in the as-deposited gold film which is reduced generally in parallel with metal deposition during the electrodeposition. In the literature, it is also reported that the gold cyanide complex ions are reduced at very high negative potentials which in turn resulting in the co-deposition of hydrogen ions [24]. Therefore, at this annealing temperature, hemispherical bulges/bubbles are formed due to the trapped hydrogen gas underneath the deposit, trying to evolve out from the deposit surface.…”

Section: Discussionmentioning

confidence: 99%

Thermal stability of pulse electroplated gold films: SEM-EBSD studies

Palli¹,

Dey²

2017

Adv Mater Sci

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This paper reports the effect of annealing at various temperatures on microstructure and microtexture of the gold films deposited onto SiO 2 /Si(100) substrate using pulsed electrodeposition (PED). The samples were annealed for 3 days at 850ºC and for 5 hours at 900ºC and 910ºC. The microstructure and thermal stability of the electrochemically deposited gold films before and after annealing was investigated using scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD) techniques. It is found that with increase of the annealing temperature the grain size of the deposits, the intensity of <0 0 1>//GD fiber texture and the volume fraction, average grain size of cube and rotated cube texture components are also increased whereas the number of grains decreased. Though maximum intensity of the <0 0 1>//GD fiber texture increases upon annealing, the deposition texture of gold film remains unchanged. The transformation of texture component of the annealed gold samples is explained by grain growth only.

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“…Due to its electronic structure, S 2 O 3 2¹ has a stronger complex ability with heavy metals than sulfate and sulfite, such as Au 50 and Cu. [51][52][53] However, the interaction between S 2 O 3 2¹ with Co, Cr, Fe and Ni is still unknown.…”

Section: Discussionmentioning

confidence: 99%

Pitting Corrosion Mechanism of Alloy 800 in Simulated Crevice Chemistries Containing Thiosulfate

Gao

Xia

et al. 2016

Electrochemistry

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Interaction of thiosulfate with Alloy 800 was systematically investigated to obtain the kinetics in a neutral simulated steam generator crevice solution. Cyclic polarization showed that the pitting potential in a thiosulfate-chloride solution was much lower than in either a chloride solution or a sulphate-chloride solution, and thiosulfate selectively and distinguishably degraded the oxide film on Alloy 800. The donor density of oxide film formed in a thiosulfatechloride solution was slightly higher than in either a chloride-only solution or a sulphate-chloride solution. Even in the passivity range the material was degraded due to the slow interaction with S 2 O 3 2− with oxide, especially when the applied potential was close to the pitting potential. The UV-visible absorption spectra showed that thiosulfate formed a stable complex with Cu 2+ , and their product was soluble in aqueous solution, which is possible evidence to indicate that thiosulfate assists Cu 2+ in dissolving from an oxide film into solution. Also, due to the complexity of the reaction, thiosulfate decreased the oxidation potential of Cu 0 to Cu 2+ . Since the Cu, an impurity in Alloy 800, normally accumulates at the grain boundary, especially at the triple points, thiosulfate induced corrosion is in the form of pitting or intergranular attack.

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Electrochemical Study of the Gold Thiosulfate Reduction

Cited by 53 publications

References 9 publications

Recovery of Gold from Pregnant Thiosulfate Solutions by the Resin Adsorption Technique

Recovery of Gold from Pregnant Thiosulfate Solutions by the Resin Adsorption Technique

Thermal stability of pulse electroplated gold films: SEM-EBSD studies

Pitting Corrosion Mechanism of Alloy 800 in Simulated Crevice Chemistries Containing Thiosulfate

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