A thin film composition gradient library of the Ni-Cu alloy system is generated through an electrodeposition technique using a complexing citrate electrolyte bath in a modified Hull cell. Energy dispersive X-ray spectroscopy, scanning electron microscopy and automated X-ray diffraction are performed to assess composition, surface morphology, and crystallographic structure of the deposited film as a function of the lateral position on the materials library. The results confirmed deposition of single phase polycrystalline f.c.c. Ni-Cu alloy system with varied lateral composition and lattice parameter, a fcc as well.
The primary current distribution and the resistance of a modified Hull cell are calculated by using conformal mapping technique coupled with numerical evaluation of the resulting integral equations. An approximate analytical expression for the primary current distribution of a modified Hull cell is presented. The primary current distribution along the cathode surface is noticed varying in controlled manner as a function of position on the substrate. The current distributions (primary, secondary, and tertiary) in the cell have also been calculated at different applied average current densities (2, 4.1, and 8.2 mA cm−2) through numerical simulation by using finite element based software. The numerical simulation result of the primary current distribution is then compared with the analytical solution and a good match is found. Experimentally, single Cu metal electrodeposition is carried out at different applied average current densities (2, 4.1, and 8.2 mA cm−2) in a modified Hull. The current distribution (primary, secondary, and tertiary) results obtained from the numerical simulation are compared with the experimental results and a satisfactory match is found. Surface morphology of the Cu deposits is examined using scanning electron microscopy (SEM).
This paper reports the effect of annealing at various temperatures on microstructure and microtexture of the gold films deposited onto SiO 2 /Si(100) substrate using pulsed electrodeposition (PED). The samples were annealed for 3 days at 850ºC and for 5 hours at 900ºC and 910ºC. The microstructure and thermal stability of the electrochemically deposited gold films before and after annealing was investigated using scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD) techniques. It is found that with increase of the annealing temperature the grain size of the deposits, the intensity of <0 0 1>//GD fiber texture and the volume fraction, average grain size of cube and rotated cube texture components are also increased whereas the number of grains decreased. Though maximum intensity of the <0 0 1>//GD fiber texture increases upon annealing, the deposition texture of gold film remains unchanged. The transformation of texture component of the annealed gold samples is explained by grain growth only.
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