Abstract:Sn is a promising candidate anode material with a high theoretical capacity (994 mAh/g). However, the drastic structural changes of Sn particles caused by their pulverization and aggregation during charge–discharge cycling reduce their capacity over time. To overcome this, a TiNi shape memory alloy (SMA) was introduced as a buffer matrix. Sn/TiNi SMA multilayer thin films were deposited on Cu foil using a DC magnetron sputtering system. When the TiNi alloy was employed at the bottom of a Sn thin film, it did n… Show more
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