Electrochemical process for advanced package fabrication

Micro-scale metallization of high aspect-ratio Cu and Au lines on flexible polyimide substrate by electroplating using SU-8 photoresist mask

“…But at the thickness larger than 1.5 lm, resistivity became saturated at @1.8 · 10 À6 X AE cm that is close to the resistivity of bulk copper @1.7 · 10 À6 X AE cm. Other measurements showed that resistivity values of Cu by chemical vapor deposition and sputtering are @2 · 10 À6 X/cm [37] and @ 3 · 10 À6 X AE cm [38], respectively. Other reported resistivity values obtained by electroplating are in the range of 1.8-1.9 · 10 À6 X AE cm [39], similarly to the value obtained in this experiment.…”

The Path from Invention to Product for the Magnetic Thin Film Head

“…As the speed of the computer increased, interconnections became a significant factor in computer performance and took on the form of transmission lines with precisely fabricated structures. While the details of interconnection technology are beyond the scope of this chapter, it may be noted that during the 1990s, electroplating also assumed a key role in the fabrication of critical interconnections [2,3].…”

Electrodeposition Science and Technology in the Last Quarter of the Twentieth Century

“…3). 27 In 1997 IBM announced that it would use electroplated copper wiring in advanced IC chips, replacing the vapor deposited aluminum used previously. Compared to aluminum, copper has a higher conductivity and a better resistance to deterioration by electric migration at high current densities.…”