Electrochemical migration of directly printed Ag electrodes using Ag paste with epoxy binder

Noh, Bo‐In; Yoon, Jeong‐Won; Kim, Kwang‐Seok; Kang, Sayoon; Jung, Seung‐Boo

doi:10.1016/j.mee.2012.08.013

Cited by 21 publications

(6 citation statements)

References 11 publications

(23 reference statements)

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“…The measured resistivity values of the 100-nm-thick Ag film/glass, patterns 1 and 2 were 0.43 × 10 −5 , 9.54 × 10 −5 and 1.98 × 10 −5 Ω cm, respectively. These values were respectively about 2.7, 60 and 12 times the bulk resistivity of Ag (1.62 × 10 −6 Ω cm) [43]. The electrical conductivity was actually thickness-dependent in the case of laser ablation of Ag films, resulting in the significant difference in resistivity of the two Ag patterns.…”

Section: Resultsmentioning

confidence: 92%

Selective laser ablation and patterning on Ag thin films with width and depth control

Huang

Zhang

et al. 2020

J Mater Sci: Mater Electron

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Silver (Ag) films were deposited on glass substrates by radio frequency (RF) magnetron sputtering and then ablated by a 532 nm nanosecond pulsed laser. The effects of laser fluence and defocusing amount on the width and depth of laser-ablated grooves on 100-and 600-nm-thick Ag films were systematically investigated under single-and multi-scan ablation. The results suggested that the Ag films could be successfully removed from the substrate owing to laser-induced thermoelastic force or vaporization. It was confirmed that laser fluence and defocusing amount played very important roles in controlling the width and depth of the laser-ablated grooves. In the present work, grooves with widths ranging from 53 to 196 μm and depths ranging from 56 to 196 nm were obtained on 100-nm-thick Ag films by single-scan laser ablation, and laser ablation or removal with controllable depths was realized on 600-nm-thick Ag films by adopting single-or multi-scan (i.e., scanning numbers of 1-6). Furthermore, square spiral Ag patterns were successfully obtained by single-and multi-scan laser ablation and showed good electrical conductivity in a simple circuit. This work may have great potential applications in various fields that demand width and depth control of laser ablation/removal.

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Section: Resultsmentioning

confidence: 92%

Selective laser ablation and patterning on Ag thin films with width and depth control

Huang

Zhang

et al. 2020

J Mater Sci: Mater Electron

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“…[1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18] In this work, two-electrode-system was also employed to detect the failure time of circuits and in situ observe the ECM development (See Figure 1). …”

Section: Methodsmentioning

confidence: 99%

“…In order to simulate the practical service environment of electronics, two-electrode system where a bias is directly applied across the two electrodes (without a real reference electrode) was generally used. [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18] In this work, two-electrode-system was also employed to detect the failure time of circuits and in situ observe the ECM development (See Figure 1).…”

Section: Methodsmentioning

confidence: 99%

“…The ECM behaviors of Sn and its alloys have attracted considerable attentions due to their significant roles as conducting or welding materials in electronic devices. [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18] Each material has its own migration characteristic and mechanism. As another key factor in ECM behaviors of materials, solution chemistry, such as the concentration of the aggressive ions, 11,12,17 the species categories including chloride ions, 2,11,16,17,19 bromide ions, 2 adipic acid, 2 sulfate ions, 19,20 dusty, 2 are also strongly concerned by many researchers.…”

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confidence: 99%

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In Situ Study the Electrochemical Migration of Tin under Unipolar Square Wave Electric Field

Zhong

Guo

Qiu

et al. 2013

J. Electrochem. Soc.

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Electrochemical migration (ECM) behaviors of tin under unsteady state electric field were investigated via thin electrolyte layer (TEL) method using optical and electrochemical techniques. Unipolar square waves with various time periods and duty cycles were first used as the unsteady state electric field for ECM investigation, where a 3-V-bias and a 0-V-bias were applied across the two electrodes during the ON time and OFF time, respectively. The results show that there is a reverse polarization applied across the two electrodes during the OFF time to ensure the 0-V-bias. The presence of reverse polarization will result in ions migration reverse to their original migration direction and the tin ions that migrated back may even be reduced back to metal tin. Therefore, the reverse polarization is adverse to the ECM process of tin. At the same time period, the rate of dendrites growth increases with the increase of duty cycle. While, for the same duty cycle, the prolongation of time period is favorable for the precipitates formation and/or dendrites growth. The influence mechanisms of time period and duty cycle on ECM behaviors have also been proposed, respectively.Electrochemical migration (ECM), which poses a great threat to the reliability of electronic devices, has attracted considerable attentions. 1-3 This process occurs when two oppositely biased and closely spaced electrodes are connected by a continuous aqueous electrolyte layer. During ECM, metal will dissolve at the anode and then the dissolved metal cations migrate toward the negatively charged cathode, where they can be reduced to metallic dendrites and grow toward anode. Ultimately, such a dendrite can lead to a short circuit as soon as it reaches the anode, thus cause catastrophic failure of electronic devices.ECM has been widely investigated regarding the test methods and its influencing factors. Up to now, there are three common test methods for ECM investigations. The first one is the droplet test (sometimes called water drop test), which can be performed rapidly and is suitable for quantitative investigations. 1-6 The second one is the simulated environment experiment (such as thermal humidity bias test (THB) and highly accelerated stress test (HAST)). 7-10 This method is the most practical way because it can well simulate the environmental conditions that the electronic devices are in service. The last one is the thin electrolyte layer (TEL) test proposed by our group, which is more suitable for quantitative real time in situ study with a good reproducibility. 11,12 ECM behaviors are mainly influenced by materials, solution chemistry and electric field. The ECM behaviors of Sn and its alloys have attracted considerable attentions due to their significant roles as conducting or welding materials in electronic devices. 1-18 Each material has its own migration characteristic and mechanism. As another key factor in ECM behaviors of materials, solution chemistry, such as the concentration of the aggressive ions, 11,12,17 the species categories includi...

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“…The investigation of the ECM of the pastes was carried out by a water drop (WD) test [22]. A 0.3 ml drop of distilled water was placed between two electrodes with a gap of 0.5 mm, and a 5 V bias voltage was applied.…”

Section: Characterizationmentioning

confidence: 99%

Ag-Sn bimetallic nanoparticles paste for high temperature service in power devices

Wang

et al. 2020

Nanotechnology

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In this paper, high strength Cu−Cu interconnections were achieved by sintering the paste of Ag-Sn bimetallic nanoparticles at low temperature. Compared with nano-Ag paste, the outer Sn coatings of the nano-Ag particles were found to be favorable for the densification of the bondline. The microstructures of Ag-Sn bimetallic nanoparticles and the bondlines under different sintereing conditions were studied in detail by x-ray photoelectron spectroscopy (XPS), x-ray diffraction (XRD), scanning electron microscopy (SEM), and transmission electron microscopy (TEM). The Ag-Sn bimetallic nanoparticles bondline exhibit a high shear strength of 35.3 MPa and a low resistivity of 9.5 μΩ cm, when sintered at 260 °C for 20 min under a pressure of 0.5 MPa. The electrochemical migration time of this sintered Ag-Sn bimetallic nanoparticles was prolonged to be ten times of that of sintered nano-Ag. This bonding technology based on Ag-Sn bimetallic nanoparticles was a promising die attach method for high temperature power device packaging.

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Electrochemical migration of directly printed Ag electrodes using Ag paste with epoxy binder

Cited by 21 publications

References 11 publications

Selective laser ablation and patterning on Ag thin films with width and depth control

Selective laser ablation and patterning on Ag thin films with width and depth control

In Situ Study the Electrochemical Migration of Tin under Unipolar Square Wave Electric Field

Ag-Sn bimetallic nanoparticles paste for high temperature service in power devices

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