Ag-Sn bimetallic nanoparticles paste for high temperature service in power devices

Abstract

In this paper, high strength Cu−Cu interconnections were achieved by sintering the paste of Ag-Sn bimetallic nanoparticles at low temperature. Compared with nano-Ag paste, the outer Sn coatings of the nano-Ag particles were found to be favorable for the densification of the bondline. The microstructures of Ag-Sn bimetallic nanoparticles and the bondlines under different sintereing conditions were studied in detail by x-ray photoelectron spectroscopy (XPS), x-ray diffraction (XRD), scanning electron microscopy (SEM), and transmission electron microscopy (TEM). The Ag-Sn bimetallic nanoparticles bondline exhibit a high shear strength of 35.3 MPa and a low resistivity of 9.5 μΩ cm, when sintered at 260 °C for 20 min under a pressure of 0.5 MPa. The electrochemical migration time of this sintered Ag-Sn bimetallic nanoparticles was prolonged to be ten times of that of sintered nano-Ag. This bonding technology based on Ag-Sn bimetallic nanoparticles was a promising die attach method for high temperature power device packaging.

Synthesis of Citrate-Capped Sn Nanoparticles with Excellent Oxidation Resistance for High-Performance Electrically Conductive Adhesives

“…Metal nanoparticles are promising for manufacturing high-performance printable electronics for various applications. − Currently, metallic silver is the most widely used material, but cost-effective alternatives urgently need to be developed due to its relatively expensive cost. Tin (Sn) metal is a promising alternative to metallic silver due to its low cost, low melting point, and good chemical stability in bulk. − However, the route to obtain Sn nanoparticles and the electronic device based on them is still limited by the high intrinsic reactivity. − These nanoparticles are susceptible to re-oxidation in air, either after synthesis, during purification, or when the material is stored. − Therefore, developing tin nanoparticles with high antioxidation properties and excellent dispersibility is necessary to realize their potential fully.…”

Copper Nanoplates for Printing Flexible High-Temperature Conductors

“…(c) The image shows the final product of the printed sample. (d) Ashby plot of the operating temperature vs conductivity for different printable inks, which have been investigated (Pt, GaIn, Au, Sn, Cu/Ni, graphene, Ag–Sn) or is commercially available (Ag, C, Ni). The red stars are printed conductors discussed in this work.…”