Cu@Sn@Ag core–shell particles preform for power device packaging under harsh environments

Liu, Hao; Yu, Feng; Wang, Xinjie; Wang, Jianqiang; Hang, Chunjin; Chen, Hongtao; Li, Mingyu

doi:10.1007/s10854-021-06026-x

Cited by 3 publications

(1 citation statement)

References 19 publications

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“…6. The average shear strength of the Cu@Sn@Ag solder joint is ∼35 MPa, which exceeds that of the same system soldered with, namely, Cu@Sn@Ag, 18 Cu@Sn, 19 Ag-SnBi, 20 and commercial PbSn5Ag2.5 solder joints, and is similar to that of a sintered nanosilver 21 solder joint.…”

Section: Resultsmentioning

confidence: 66%

Preparation and performance of semiconductor device bonding joints based on Cu@Sn@Ag preform

Zhang,

Xu,

Wang

et al. 2023

RSC Adv.

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Section: Resultsmentioning

confidence: 66%

Preparation and performance of semiconductor device bonding joints based on Cu@Sn@Ag preform

Zhang,

Xu,

Wang

et al. 2023

RSC Adv.

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Investigation on high-temperature long-term aging of Cu-Sn intermetallic joints for power device packaging

Peng

Wang²,

Zheng³

et al. 2022

J Mater Sci: Mater Electron

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A Review of Recent Research Trends of Forming of Metallic Bondlines Using Core-Shell Particles and Bonding Properties According to Particle Type

Han,

Kim,

Lee

2023

Korean J. Met. Mater.

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With the increasing numbers of electric vehicles and the prevalence of high heat generating devices, recent studies have attempted to address the limitations of conventional solder materials, including their low durability at temperatures exceeding 200 ℃, insufficient mechanical properties in a joint, and low thermal conductivity. Transient liquid-phase (TLP) partial bonding using solders or Sn, and sinter bonding using Ag particles, are alternative bonding methods which involve a modification or change of the material. Advanced alternatives can significantly reduce bonding time or material cost. Various additional studies have investigated various core-cell particles that can be used to form an all-metallic bondline. This review summarizes reports of bonding studies using different core-cell particles. The particles were not only applied as a form of paste but also preform. In the TLP bonding using X(Cu, Ag, Ni)@Sn particles, the degree of voids generated in the formed bondline was dependent on the type of intermetallic compound formed. The preforms consisting of X@Sn particles provided relatively uniform microstructure and void distribution, compared to the pastes containing identical X@Sn particles, resulting in better long-term mechanical reliability. The addition of Zn@Sn particles contributed to the more practical control of microstructure and mechanical properties in the joint formed by pure Sn and Sn-58Bi solder alloys. Cu@Ag particles can be considered a promising low-cost material for compression-assisted sinter bonding, replacing pure Ag particles. The application of core-cell particles is expected to improve the processes used for forming metallic bondlines.

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Cu@Sn@Ag core–shell particles preform for power device packaging under harsh environments

Cited by 3 publications

References 19 publications

Preparation and performance of semiconductor device bonding joints based on Cu@Sn@Ag preform

Preparation and performance of semiconductor device bonding joints based on Cu@Sn@Ag preform

Investigation on high-temperature long-term aging of Cu-Sn intermetallic joints for power device packaging

A Review of Recent Research Trends of Forming of Metallic Bondlines Using Core-Shell Particles and Bonding Properties According to Particle Type

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