Electrochemical migration behaviour of Cu, Sn, Ag and Sn63/Pb37

Medgyes, Bálint; Illés, Béla; Harsányi, Gábor

doi:10.1007/s10854-011-0435-5

Cited by 77 publications

(44 citation statements)

References 12 publications

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“…Taking the case of Cu dealt with in this study, a lytic reaction occurs at the anode electrode under self-oxidation as (1) It is obvious that the elution process of Cu + ions has the lower activation energy than that of Cu 2+ ions (Medgyes et al, 2012). At the same time, water oxidation occurs at the anode as (2) Cu + ions then combine with OH -ions to form Cu(OH), which is not stable and decomposes to Cu2O and H2O as (3) In the parallel, the reduction process in which the metal is precipitated occurs at the cathode as (4) Also, water reduction to give hydroxide ions at the cathode is likely to occur continuously during the electrolysis as (5) With the lapse of time, the metal ions elute to pure water.…”

Section: Theoretical Backgroundmentioning

confidence: 99%

Enhanced fabrication of hybrid Cu-Cu<sub>2</sub>O nanostructures on electrodes using electrochemical migration

Fukaya

Aoki

Kimura

et al. 2018

Mechanical Engineering Letters

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Cu, Cu2O and CuO nanostructures have characteristic physical properties, and are used in a variety of fields such as lithium ion batteries, solar batteries and gas sensors. Recently, various techniques for the nanostructures fabrication have been studied for these applications. It has been reported that electrochemical migration (ECM) causes insulation deterioration on the printed circuit boards in high-humidity and high-temperature conditions. Previous investigations of the suppression of ECM revealed that eluted Cu ions grew as dendrites. A considerable number of studies have investigated the suppression of ECM, but the beneficial use of ECM has not been studied extensively. The use of ECM has become the subject of increasing interest because ECM is a low-cost and green fabrication technique, and the reaction requires only DC voltage and water without any metal salts and hydroxides. Some attempts have been made to fabricate hybrid Cu-Cu2O nanostructures using ECM. However, it has been reported that the growth of dendrites between electrodes ceases because the dendrites create a shortcircuit. Thus, proper fabrication has not yet been achieved. This study aimed to enhance the fabrication of hybrid Cu-Cu2O nanostructures using ECM. In this study, we changed the path length of the dendrites' growth, and improved the fabrication process through evaluation of the results.

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Section: Theoretical Backgroundmentioning

confidence: 99%

Enhanced fabrication of hybrid Cu-Cu<sub>2</sub>O nanostructures on electrodes using electrochemical migration

Fukaya

Aoki

Kimura

et al. 2018

Mechanical Engineering Letters

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“…Dendrite growth can lead to bridging. Many types of the metals, which are widely used in the electronics industry have huge ability for ECM, such as Sn, Ag or Cu [5]. Silver is also widely investigated related to ECM [5][6][7][8][9][10].…”

Section: Introductionmentioning

confidence: 99%

“…On the other hand, migration tests in thin electrolyte layers (TEL) is also important, since ECM ability depends on the thickness of water layer as well [14]. Furthermore, the concentrations of the used electrolytes had a wide range as well: deionized water [5], acidic or alkaline electrolytes [15] and also salt electrolytes [16], which usually simulate the possible contamination effects. One of the most common contaminant is the Cl, which can strongly modify the electrochemical corrosion mechanism and therefore, the migration ability of tin and silver as well.…”

Section: Introductionmentioning

confidence: 99%

Electrochemical migration of Sn and Ag in NaCl environment

Medgyes

Szivos

Adam

et al. 2016

2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging (SIITME)

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Abstract-The impact of chloride ion concentration on electrochemical migration (ECM) of tin and silver was studied by using an in-situ optical and electrical inspection system. It was found, that in both cases, dendrites grow not only in an electrolyte solution at low chloride concentration but also in an electrolyte at medium and high or even saturated chloride concentrations as well. According to the results, the migration susceptibility has decreased at low and medium concentration levels in both cases. However, the ECM susceptibility of Ag has increased, while the migration susceptibility of Sn was decreased at the saturated concentrations.

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“…So, the dendrites are kinds of conductive filaments and therefore, they can form shorts. Many types of metals that are widely used in the electronics have relevant ability for ECM, such as tin, silver or copper [2]. Next to Ag, Cu and Sn are also widely studied from the ECM point of view [2][3][4][5][6][7][8][9][10].…”

Section: Introductionmentioning

confidence: 99%

“…The electrochemical corrosion and ECM tests of Cu and Sn were usually investigated in bulk solutions [2,4,6,10,15]. On the other hand, the importance of thin electrolyte layer (TEL) tests are growing [16,17], hence ECM susceptibility depends also on the thickness of water layer [18].…”

Section: Introductionmentioning

confidence: 99%