2008
DOI: 10.1088/0957-4484/19/20/205601
|View full text |Cite
|
Sign up to set email alerts
|

Electrochemical fabrication of Sn nanowires on titania nanotube guide layers

Abstract: We describe a novel approach for the fabrication of tailored nanowires using a two-step electrochemical process. It is demonstrated that self-organized TiO(2) nanotubes can be used to activate and guide the electrochemical growth of Sn crystallites, leading to the formation of vertical features with a high aspect ratio. We show that the dimensions and the density of Sn crystallites depend on the electrodeposition parameters.

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

2
25
1

Year Published

2009
2009
2014
2014

Publication Types

Select...
5
2

Relationship

3
4

Authors

Journals

citations
Cited by 40 publications
(28 citation statements)
references
References 21 publications
(21 reference statements)
2
25
1
Order By: Relevance
“…Compared to our previous works, 19,20 the morphology is spongelike and the particles tend to form an interconnected porous network composed of SnO. 1b and c͒.…”
Section: Resultscontrasting
confidence: 59%
“…Compared to our previous works, 19,20 the morphology is spongelike and the particles tend to form an interconnected porous network composed of SnO. 1b and c͒.…”
Section: Resultscontrasting
confidence: 59%
“…The titania nanotubes were used to guide the growth of Sn or Fe nanowires by electrodeposition (see Figure 28). 88a, 126a,b…”
Section: Titania Versus Nanostructured Titaniamentioning
confidence: 99%
“…As a function of the anodization conditions, diameters may vary between 30 and 200nm while lengths can be adjusted between 200nm and 1000 μm when working in non-aqueous electrolytes (27,28). More recently, it was shown that self-assembled titania nanotubes can be used as seed layers for the fabrication of vertical tin nanowires (29)(30)(31). The fact that self-assembled TiO 2 nanotube arrays can be prepared on Si wafers (32)(33)(34) constitutes another important asset of these materials opening the path towards on-chip integration of many of the applications mentioned above.…”
Section: Introductionmentioning
confidence: 99%