Electrochemical copper deposition from an ethaline-CuCl2·2H2O DES

Ghosh, Swatilekha; Roy, Sudipta

doi:10.1016/j.surfcoat.2013.10.069

Cited by 52 publications

(38 citation statements)

References 42 publications

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“…These 'type-III' DES systems have been used to deposit a wide range of metals including Al, Zn, Fe, Ni, Sn, Cr, Al and Cu [2][3][4][5][6][7] . Studies [8][9][10][11][12][13][14] of copper deposition have been particularly common as it is used extensively in the electronics and microelectronic industries and can be regarded as a model system. Additionally there is a large body of existing studies of 4 Cu deposition from conventional ILs and aqueous systems which can be used to benchmark DES-based processes.…”

Section: In 2003mentioning

confidence: 99%

Anodic Reactions and the Corrosion of Copper in Deep Eutectic Solvents

Green

Valverde

Roy

2018

J. Electrochem. Soc.

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An analysis of the anodic reaction occurring at soluble copper anodes during the electrodeposition of copper from an ethaline-based deep eutectic solvent (DES) has been performed. It was shown by UV-Vis spectroscopy and electrochemical measurements that the dominant anodic species produced is the CuCl 2 -complex. In pure ethaline the current efficiency of the anodic process is 100% and the dissolution valency is one. However, in the presence of Cu(II) species the apparent dissolution valency measured gravimetrically was typically less than unity, corresponding to an observed mass loss greater than that expected from Faraday's law.Moreover, the apparent dissolution valency showed a marked dependence on the electrode

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Section: In 2003mentioning

confidence: 99%

Anodic Reactions and the Corrosion of Copper in Deep Eutectic Solvents

Green

Valverde

Roy

2018

J. Electrochem. Soc.

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“…The electrodeposition of copper has been investigated for a variety of applications, and the anodic dissolution of metallic copper has been thoroughly studied in ionic liquid (IL) and deep eutectic solvent (DES) media [1][2][3][4][5][6][7][8][9][10]. Previously, the anodic dissolution of metallic copper has been thoroughly examined in aqueous media [11][12][13].…”

Section: Introductionmentioning

confidence: 99%

The Anodic Behaviour of Bulk Copper in Ethaline and 1-Butyl-3-Methylimidazolium Chloride

et al. 2019

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The anodic dissolution of bulk metallic copper was conducted in ionic liquids (ILs)-a deep eutectic solvent (DES) ((CH 3 ) 3 NC 2 H 4 OH) comprised of a 1:2 molar ratio mixture of choline chloride Cl (ChCl), and ethylene glycol (EG)-and imidazolium-based ILs, such as C 4 mimCl, using electrochemical techniques, such as cyclic voltammetry, anodic linear sweep voltammetry, and chronopotentiometry.To investigate the electrochemical dissolution mechanism, electrochemical impedance spectroscopy (EIS) was used. In addition to spectroscopic techniques, for instance, UV-visible spectroscopy, microscopic techniques, such as atomic force microscopy (AFM), were used. The significant industrial importance of metallic copper has motivated several research groups to deal with such an invaluable metal. It was confirmed that the speciation of dissolved copper from the bulk phase at the interface region is [CuCl 3 ] − and [CuCl 4 ] 2− in such chloride-rich media, and the EG determine the structure of the interfacial region in the electrochemical dissolution process. A super-saturated solution was produced at the electrode/solution interface and CuCl 2 was deposited on the metal surface.Gu et al. studied electrodeposition and the corrosion behaviour of copper in a choline chloride-ethylene glycol DES. In the electrodeposition process, a rough surface was obtained with the addition of ethylene diamine; the corrosion decreased and a relatively uniform surface was gained [5]. Many research groups have tried to deal with the physical properties of ethaline (choline chloride-ethylene glycol). it was found that the mass transport could be increased with an increasing temperature; when the temperature was increased to 50 • C, the viscosity decreased by 65% [7]. Concerning the physical properties of the electrolyte, such as conductivity and viscosity, it was found that it is insensitive to metal-salt addition but strongly temperature dependent [9]. The speciation of copper is well-defined in choline-based DESs. It was determined to be [CuCl 3 ] 2− and [CuCl 4 ] 2− for Cu(I) and Cu(II), respectively [20]. The dissolution of bulk copper was studied previously in these media, in the present work attempt was directed to deal with copper in more detail [21]. Deep eutectic solvents (DESs) are attracting significant research interest as electrochemical media, especially for electrodeposition, as they share many of the useful properties of ILs, but are typically greener and cheaper [22]. The influence of water and the changing potential on the interfacial region between a platinum electrode and a DES were studied. It was found that the nanostructural feature of interface decreased in the presence of small amount of water and was also strongly potential dependent [23].The aim of this work is to investigate the dissolution mechanism of copper in a DES and its comparable IL and compare it to the aqueous system. This is important for counter-electrode processes during electrodeposition, for electropolishing, and also to understand whether metallic co...

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“…DES exhibit important properties, including high conductivity, relatively wide potential range of electrochemical stability, low vapor pressure, and ability to solvate many metal salts [6]. All these properties make DES good candidates to be used as electrolytes for the electrodeposition of metals [7,8], alloys [9] and semiconductors [2,5].…”

Section: Introductionmentioning

confidence: 99%

Electrodeposition of indium on W and Cu electrodes in the deep eutectic solvent choline chloride-ethylene glycol (1:2)

Barrado

García

Rodríguez

et al. 2018

Journal of Electroanalytical Chemistry

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A B S T R A C TA procedure for drying the deep eutectic solvent (DES) choline chloride -ethylene glycol, ChCl-EG (1:2), based on the use of molecular sieves has been developed, being the final water content of the electrolyte 145 ± 5 ppm. In this dried DES, the stability of InCl and InCl 3 as well as the electrochemical behaviour of their solutions has been investigated using electrochemical techniques, X-ray diffraction analysis (XRD) and scanning electron microscopy (SEM). Experiments performed under a N 2 atmosphere show that InCl 3 , dissolved in the rich chloride media as InCl p 3-p , is reduced on a tungsten electrode to indium metal via only one electrochemical step.Conversely, InCl undergoes the following disproportionation reaction when dissolved in the eutectic ChCl-EG (1:2)generating In(0) and giving place to identical electrochemical signals as those obtained after the addition of InCl 3 to the DES.On a tungsten electrode, nucleation and crystal growth of In plays an important role in the electrodeposition process. Chronoamperometric results were consistent with instantaneous three dimensional nucleation on a finite number of active sites with diffusion controlled growth of the nuclei, whatever the applied overpotential and temperature. Mass transport towards the electrode is a diffusion process, and the following empirical expression for the temperature dependence of the diffusion coefficient was calculated.= − ± ± − ( . . )-( ) 1 LnD 3 58 0 22 3665 76 TThe electro-reduction of In(III) solutions was also investigated at a copper substrate. The resulting cyclic voltammograms evidenced the formation of In-Cu intermetallic compounds. Hence, In-Cu alloy films were obtained by continuous potentiostatic electrolysis and intensiostatic pulse electrolysis. The obtained samples, characterized by XRD and SEM, revealed the formation of the metastable CuIn phase that could be transformed into Cu 11 In 9 by thermal annealing.

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Electrochemical copper deposition from an ethaline-CuCl2·2H2O DES

Cited by 52 publications

References 42 publications

Anodic Reactions and the Corrosion of Copper in Deep Eutectic Solvents

Anodic Reactions and the Corrosion of Copper in Deep Eutectic Solvents

The Anodic Behaviour of Bulk Copper in Ethaline and 1-Butyl-3-Methylimidazolium Chloride

Electrodeposition of indium on W and Cu electrodes in the deep eutectic solvent choline chloride-ethylene glycol (1:2)

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