“…Blocking layers are widely used in DSSC to prevent recombination of the electron in the semiconductor or FTO with the electrolyte. Blocking layers are often thin insulating layers of TiO2 [6], ZnO [7,8], ZrO2 [9,10], SiO2 [9], Al2O3 [9,11], MgO [12,13], HfO2 [14], CdO [15], or polysiloxane [16] deposited on working electrode by various techniques like spray pyrolysis [17], sputtering [18], spin coating [19], dip coating [20], chemical vapor deposition [21], sol-gel deposition [9], TiCl4 treatment [6], chemical bath deposition [22] or atomic layer deposition [23]. The ideal blocking layer should cover the entire surface of the FTO and TiO2 to prevent recombination and should not prevent electron injection.…”