Electrochemical characteristics of boron doped polycrystalline diamond electrode sintered by high pressure and high temperature

Abstract

The bulk B-doped polycrystalline diamond (PCD) electrode in this study was prepared by high-pressure, high-temperature (HPHT) technology. The PCD was sintered under HPHT conditions, using B-doped diamond powders and a metal catalyst as raw materials, then the metal solvent phase was dissolved by aqua regia. The morphology and composition of the PCD were investigated with a scanning electron microscope (SEM), X-ray diffraction (XRD), and energy dispersion spectrum (EDS). The results show that the sintered body possesses a polycrystalline structure with direct diamond-diamond bond and irregularly shaped pores of 1-10 lm distributed on the grain boundaries after the metal solvent phase was removed. The cyclic voltammogram and electrochemical impedance spectroscopy of this B-doped electrode have been investigated. The B-doped PCD electrode exhibits stable electrochemistry in a KCl support solution over a wide potential range. The quasi-reversible reaction occurs on the electrode for the [Fe(CN) 6 ] 3-/4-couples. The electrode process combines the diffusion-controlled mass transport plus the kinetic process. The electrochemical impedance spectroscopy (EIS) analysis shows the porous structure characteristic of the PCD electrode.

High-performance activated carbon from polyaniline for capacitive deionization

“…The C C is the capacitance at the interface electrolyte/electrode at high frequencies [74,75], while the capacitance of the capacitor element (C d ) in the equivalent circuit is associated to the capacitance developed inside the micropores of the carbon electrode [74,76]. According to Table 4, it can be observed that PAC/PTS has the highest values of C C and C d among the electrodes studied; which C d represents the main contribution to the total electrode capacitance.…”

Synthesis and characterization of sub-micron sized copper–ruthenium–tantalum composites for interconnection application

“…Powder metallurgy is a promising method of synthesizing copper and copper composites due to its good densification and ease of operation with cost effective [1,10]. Powder metallurgy techniques have been used to synthesize copper and copper composite powders as well as other composites for different electronics applications [19,20]. Besides, there is virtually no reported study on the combined effects of tantalum and ruthenium on the mechanical properties of submicron copper and copper composites for interconnect materials, studies on similar copper based composites synthesized by high pressure high temperature is also very limited.…”