Electrochemical behavior of a new solder material (Sn–In–Ag)

Oulfajrite, Hassan; Sabbar, A.; Boulghallat, M.; Jouaiti, Ahmed; Lbibb, Rachid; Zrineh, A.

doi:10.1016/s0167-577x(03)00326-4

Cited by 37 publications

(11 citation statements)

References 10 publications

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“…Some researchers have studied the corrosion behaviour of Sn-Zn-X solders [3,8], SnIn-Ag solder [9] and Sn-Zn-Ag-Al-XGa [10], but few [11,12]have studied the corrosion properties of Sn-Ag, Sn-Cu and Sn-Ag-Cu solders.…”

Section: Introductionmentioning

confidence: 99%

Corrosion characterization of tin–lead and lead free solders in 3.5wt.% NaCl solution

2008

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The corrosion resistance of Sn-Pb and several candidate lead free solders were investigated in 3.5wt.% NaCl solution through potentiodynamic polarisation. Results showed that in NaCl solution lead free solders had better corrosion resistance than SnPb solder and the corrosion resistance of lead free solders was similar, but the corrosion resistance of Sn-Ag solder was better than that of Sn-Ag-Cu and Sn-Cu solders. The corrosion products for Sn-Pb solder had a two-layered structure with Sn-rich phases at the outer layer and looser Pb-rich phases at the inner layer. The loose Pb-rich layer was detrimental to the corrosion property. The corrosion product on the surface of all these solders was tin oxide chloride hydroxide.

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Section: Introductionmentioning

confidence: 99%

Corrosion characterization of tin–lead and lead free solders in 3.5wt.% NaCl solution

2008

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“…[6][7][8][9][10][11] Some researchers have studied the corrosion behaviors of solder alloys with compositions of SnZn-X, Sn-In-Ag, and Sn-Zn-Ag-Al-XGa, but few have studied the corrosion properties of Sn-Ag-Cu. [12][13][14][15][16][17][18] In this research, deionized water was used as the corrosion solution, and the formation mechanism of tin(II) oxide crystals on the surfaces of Sn-Ag-Cu and Sn-Ag-Cu-Bi solder joints was studied and compared with that for the traditional eutectic Sn-Pb solder. The effects of different solder compositions and metal traces on the formation of tin(II) oxide crystals are discussed in detail.…”

Section: Introductionmentioning

confidence: 99%

Generation of Tin(II) Oxide Crystals on Lead-Free Solder Joints in Deionized Water

Chang

Chen

et al. 2009

Journal of Elec Materi

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The effect of the anode and cathode on the electrochemical corrosion behavior of lead-free Sn-Ag-Cu and Sn-Ag-Cu-Bi solder joints in deionized water was investigated. Corrosion studies indicate that SnO crystals were generated on the surfaces of all lead-free solder joints. The constituents of the lead-free solder alloys, such as Ag, Cu, and Bi, did not affect the corrosion reaction significantly. In contrast to lead-free solders, PbO x was formed on the surface of the traditional 63Sn-37Pb solder joint in deionized water. A cathode, such as Au or Cu, was necessary for the electrochemical corrosion reaction of solders to occur. The corrosion reaction rate decreased with reduction of the cathode area. The formation mechanism of SnO crystals was essentially a galvanic cell reaction. The anodic reaction of Sn in the lead-free solder joints occurred through solvation by water molecules to form hydrated cations. In the cathodic reaction, oxygen dissolved in the deionized water captures electrons and is deoxidized to hydroxyl at the Au or Cu cathode. By diffusion, the anodic reaction product Sn 2+ and the cathodic reaction product OH À meet to form Sn(OH) 2 , some of which can dehydrate to form more stable SnOAExH 2 O crystals on the surface of the solder joints. In addition, thermodynamic analysis confirms that the Sn corrosion reaction could occur spontaneously.

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“…The near-eutectic melting temperature of Sn0.466In0.507Ag0.027 was found to be equal to 113°C. In addition, the Sn-In-Ag solder reveals good wettability and very satisfying interaction with copper [4] .…”

Section: Low Melting Soldersmentioning

confidence: 99%

Recent progress in the studies of low melting Sn-based Pb-free solders

Lin

Yin

Wei

2011

2011 12th International Conference on Electronic Packaging Technology and High Density Packaging

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Limited by the toxicity of Pb and Pb-containing compounds and the implementation of the mandatory legislations, such as WEEE and RoHS, the Pb-containing solders have been banned and accordingly the Pb-free solders have become popular in electronic industry. However, the novel developed Pb-free solders could cause a series of packaging defects such as delamination, cracking, and charring etc. due to the relatively high melting temperatures of these Pb-free substitutes compared to the former Sn-Pb

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Electrochemical behavior of a new solder material (Sn–In–Ag)

Cited by 37 publications

References 10 publications

Corrosion characterization of tin–lead and lead free solders in 3.5wt.% NaCl solution

Corrosion characterization of tin–lead and lead free solders in 3.5wt.% NaCl solution

Generation of Tin(II) Oxide Crystals on Lead-Free Solder Joints in Deionized Water

Recent progress in the studies of low melting Sn-based Pb-free solders

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