Corrosion characterization of tin–lead and lead free solders in 3.5wt.% NaCl solution

Abstract

The corrosion resistance of Sn-Pb and several candidate lead free solders were investigated in 3.5wt.% NaCl solution through potentiodynamic polarisation. Results showed that in NaCl solution lead free solders had better corrosion resistance than SnPb solder and the corrosion resistance of lead free solders was similar, but the corrosion resistance of Sn-Ag solder was better than that of Sn-Ag-Cu and Sn-Cu solders. The corrosion products for Sn-Pb solder had a two-layered structure with Sn-rich phases at the outer layer and looser Pb-rich phases at the inner layer. The loose Pb-rich layer was detrimental to the corrosion property. The corrosion product on the surface of all these solders was tin oxide chloride hydroxide.

Introductory Chapter: Overview of Recent Progress in Soldering Materials

“…Once the corrosion has occurred, mechanical and electrical failures make the product stop. The corrosion properties of Sn-based lead-free alloys in corrosive environments have not been widely reported, even though it is important in many automotive, aerospace, maritime and defense applications [10]. Corrosion mainly originates either within the circuit (flux corrosion) or from the environment [11,12].…”

Corrosion resistance of Pb-free and novel nano-composite solders in electronic packaging

“…Therefore, there is also the potential for galvanically induced corrosion of the solder, which could exacerbate any atmospheric corrosion that might be occurring. However, the properties of these lead free alloys in corrosive environments has not been widely reported, though it is of importance in many automotive, aerospace, maritime and defence applications [46]. Some researchers have studied the corrosion behaviour of Sn-Zn-X solders [47,48] and Sn-Zn-Ag-Al-XGa [49], but few [50,51] have studied the corrosion properties of Sn-Ag, Sn-Cu and Sn-Ag-Cu solders.…”

“…Nevertheless, the four Pb-free solders exhibit acceptable corrosion properties, since there is not much difference in key corrosion parameters between them and the Sn37Pb solder. The corrosion data of the solders in 3.5 wt.% NaCl solutions are listed in Tables 5 [46,51]. Lin and Mohanty et al [46][47][48][49] studied the corrosion properties of Sn-Zn-X and Sn-Zn-AgAl-XGa in NaCl solution, and their results showed that the corrosion product on the surface could be SnO, SnO 2 , SnCl 2 and ZnO, etc., depending on the applied potential.…”

“…Lin and Mohanty et al [46][47][48][49] studied the corrosion properties of Sn-Zn-X and Sn-Zn-AgAl-XGa in NaCl solution, and their results showed that the corrosion product on the surface could be SnO, SnO 2 , SnCl 2 and ZnO, etc., depending on the applied potential. Li et al [46] confirms that the corrosion product on the Sn-Pb and lead free solders is tin oxide chloride hydroxide ( Ecorr -corrosion potential, Ip -passivation current density, Icorr -corrosion current density, Ep -passive potential. Table 5.…”

Effect of Antimony Additions on Corrosion and Mechanical Properties of Sn-Bi Eutectic Lead-Free Solder Alloy

“…In an effort to develop lead-free solders, most research up to now focused on melting points and physical strengths of alloys, and there has been little consideration of the corrosion properties of base alloys for lead-free solders [8][9][10]. Moreover, the properties of these Sn-Bi-Sb lead-free alloys in corrosive environments have not been reported, and most of the fluxes are chloride or fluoride base compounds.…”