2013
DOI: 10.1016/j.corsci.2013.01.025
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Electrochemical and theoretical investigation of triazole derivatives on corrosion inhibition behavior of copper in hydrochloric acid medium

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Cited by 219 publications
(56 citation statements)
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“…The separation energy (DE) is an important parameter as a function of reactivity of the inhibitor molecule toward the adsorption on metallic surface. As DE decreases, the reactivity of the molecule increases in visa, which facilitates adsorption and enhances the efficiency of inhibitor [36]. Inspection of the data in Table 7 reveals DE obeys the order of AHMP < DHMP, which is in completely accordance with the order of inhibition efficiency of AHMP > DHMP.…”
Section: Quantum Chemical Calculationssupporting
confidence: 63%
“…The separation energy (DE) is an important parameter as a function of reactivity of the inhibitor molecule toward the adsorption on metallic surface. As DE decreases, the reactivity of the molecule increases in visa, which facilitates adsorption and enhances the efficiency of inhibitor [36]. Inspection of the data in Table 7 reveals DE obeys the order of AHMP < DHMP, which is in completely accordance with the order of inhibition efficiency of AHMP > DHMP.…”
Section: Quantum Chemical Calculationssupporting
confidence: 63%
“…The further increase of HNO 3 concentration leads to an increase of I corr again. According to the literatures, [19][20][21][22] HNO 3 with an appropriate concentration exhibits as cathodic inhibitors for aluminum alloy 6063.…”
Section: Resultsmentioning
confidence: 99%
“…One of the most important methods in the protection of copper against corrosion is the use of organic inhibitors. The organic inhibitors such as benzotriazole derivative [3], ortho-substituted anilines [4], 2-mercapto benzimidazole [5], bis-(1,10-benzotriazoly)-a,x-diamide [6], and Schiff bases [7] have been reported as corrosion inhibitors for copper in picking acids. There is unanimity that copper dissolution involves at first, single electron transfer process leading to oxidation thereby forming Cu(I) complex [3].…”
Section: Introductionmentioning
confidence: 99%