2017
DOI: 10.1021/acsami.6b16559
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Electro-Thermal Model of Threshold Switching in TaOx-Based Devices

Abstract: Pulsed and quasi-static current-voltage (I-V) characteristics of threshold switching in TiN/TaO/TiN crossbar devices were measured as a function of stage temperature (200-495 K) and oxygen flow during the deposition of TaO. A comparison of the pulsed and quasi-static characteristics in the high resistance part of the I-V revealed that Joule self-heating significantly affected the current and was a likely source of negative differential resistance (NDR) and thermal runaway. The experimental quasi-static I-V's w… Show more

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Cited by 42 publications
(62 citation statements)
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References 48 publications
(78 reference statements)
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“…Since the device we studied involved a combination of interfacial layers and nanowires, the obtained small activation energy is only an effective trap energy state without clear indication of whether the trap states are attributed to the ZnO nanowire, TiO x interfacial layer, or one of the interfaces. Similar low activation energy values were also reported for different types of volatile resistive switching devices such as in a SiO x N y :Ag diffusive memristor and TaO x threshold switching devices . Future studies of the trap energy level distribution can be obtained using techniques such as deep level transient spectroscopy and thermal admittance spectroscopy .…”
Section: Resultssupporting
confidence: 72%
“…Since the device we studied involved a combination of interfacial layers and nanowires, the obtained small activation energy is only an effective trap energy state without clear indication of whether the trap states are attributed to the ZnO nanowire, TiO x interfacial layer, or one of the interfaces. Similar low activation energy values were also reported for different types of volatile resistive switching devices such as in a SiO x N y :Ag diffusive memristor and TaO x threshold switching devices . Future studies of the trap energy level distribution can be obtained using techniques such as deep level transient spectroscopy and thermal admittance spectroscopy .…”
Section: Resultssupporting
confidence: 72%
“…The input parameters of the simulation are the material properties (density, specific heat capacity, thermal conductivity, electrical conductivity, and the relative dielectric constant) and the circuit parameters including source voltage and load resistance. The materials properties are the same as in a previous work . The devices had a square 150 × 150 nm 2 active area, which in the simulation was approximated with axisymmetric 2D device with a radius of 170 nm.…”
Section: Methodsmentioning
confidence: 99%
“…Under a bias voltage, the neutral V O s in the V O -rich layer lose electrons and become positively charged, and then migrate into the switching layer. For example, a few studies [37][38][39][40] have pointed out that in memristive devices based on such as TaO x [40] and NbO x [38] films, the applied bias can generate pronounced Joule heating through electron conduction (e.g., via the Poole-Frenkel process) that increases the device's internal temperature. Analysis of V O -based conducting filaments has been carried out by transmission electron microscopy (TEM) studies.…”
Section: Anion-driven Rs Effectsmentioning
confidence: 99%
“…These charged V O s can be reduced and eventually form V O -rich regions that increase the device's conductance. [40] Note that when the device resistance is reduced, the Joule heating effect is also suppressed which will induce the negative differential resistance behavior and restores the device to the HRS, showing threshold RS effect. For example, for TiO 2 -based devices (Figure 2a), the conducting filaments may be composed of a metallic phase (Ti 4 O 7 ) that has an increased Ti/O atom ratio (Figure 2b).…”
Section: Anion-driven Rs Effectsmentioning
confidence: 99%
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