Electrically driven matter transport effects in PoP interconnections

Electro- and thermo-migration induced failure mechanisms in Package on Package

“…Furthermore the energy dispersive X-ray spectroscopy (EDX) was used to investigate the chemical composition and the dimension of the IMC layers [5]. The experimental results (Fig.…”

“…Furthermore the parameter variation can show new ways to more EM or stress resistant packages. The EM and the TM induced mass flux values and mass flux divergences are clearly described with (1)- (5). For the temperature distribution used in (1)(2)(3)(4)(5) and the stress distribution, the dependencies are quite more complex.…”

“…The EM and the TM induced mass flux values and mass flux divergences are clearly described with (1)- (5). For the temperature distribution used in (1)(2)(3)(4)(5) and the stress distribution, the dependencies are quite more complex. Hence a sensitivity analysis was performed by changing the material parameters of a few important parts of the package, and the heat transport coefficient (HTC) of the whole package.…”

“…In solder joints the material transport leads to void formation [2][3][4] and an accelerated intermetallic compound (IMC) growth [5,6]. While void formation directly leads to open contacts, the IMC (Cu 6 Sn 5 and Cu 3 Sn) growth influences the crack formation, and reduces the time to failure (TTF) during drop tests [7].…”

Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers

“…The reflow of the solder joints leads to the formation of an initial IMC [1]. Later material movements due to electromigration, thermomigration or concentration gradients lead to an additive IMC growth [2,3]. With shrinking size of the solder contacts for IC packaging the formation of intermetallic compound layers becomes more and more important.…”