Dynamical IMC-growth calculation

Meinshausen, L.; Weide‐Zaage, Kirsten; Frémont, Hélène

doi:10.1016/j.microrel.2015.06.052

Cited by 7 publications

(2 citation statements)

References 9 publications

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“…Among them, Sn-rich solder, which contains considerable amounts of Sn in the solder matrixes, is widely adopted in solder joints that are assembled via under-bump metallization (UBM), using a solder alloy and intermetallic compound (IMC) at the interface between the solder and the UBM method via a reflow process at a suitable temperature [ 16 , 17 , 18 ]. The reliability issues of Sn-rich solder joints have drawn substantial concerns, the first of which is the EM reliability during a consistent electron flow with a critical current density in Sn-rich solder joints [ 19 , 20 , 21 ], inducing UBM dissolution, rapid IMC growth, void formation, and severe Joule heating [ 22 , 23 , 24 , 25 ]. Then, the Joule heating induces a temperature gradient in the solder joint, known as the TM [ 22 , 26 , 27 , 28 ].…”

Section: Introductionmentioning

confidence: 99%

Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints

Shen

2022

Materials

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Sn-rich solder joints in three-dimensional integrated circuits and their reliability issues, such as the electromigration (EM), thermomigration (TM), and thermomechanical fatigue (TMF), have drawn attention related to their use in electronic packaging. The Sn grain orientation is recognized as playing an important role in reliability issues due to its anisotropic diffusivity, mechanical properties, and coefficient of thermal expansion. This study reviews the effects of the Sn grain orientation on the EM, TM, and TMF in Sn-rich solder joints. The findings indicate that in spite of the failure modes dominated by the Sn grain orientation, the size and shape of the solder joint, as well as the Sn microstructures, such as the cycling twining boundary (CTB), single crystals, and misorientations of the Sn grain boundary, should be considered in more detail. In addition, we show that two methods, involving a strong magnetic field and seed crystal layers, can control the Sn grain orientations during the solidification of Sn-rich solder joints.

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Section: Introductionmentioning

confidence: 99%

Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints

Shen

2022

Materials

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“…During the service of the Cu parts, the deficient wear resistance and the growth of the interface metallic compounds always result in an insufficient service life [1,2]. For example, bearings made of Cu alloys still require better surface mechanical properties to enhance the adhesion and bonding strength [3][4][5], and the controlled growth of the interface metallic compounds (IMC) in the microelectronic devices is now facing great challenges [6][7][8][9].…”

Section: Introductionmentioning

confidence: 99%

Cross-Sectional Profile Evolution of Cu-Ti Gradient Films on C17200 Cu by Vacuum Thermal Diffusion

Zhu

et al. 2022

Materials

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To improve the wear resistance and fatigue life of Cu alloys, surface modification by combining the magnetron sputtering of Ti film followed by vacuum thermal diffusion is always applied, where the structure and composition of the fabricated film play a determinant role on the mechanical properties. In the present work, the evolution of the layered structure and the element distribution of the formed multi-phases coating on C17200 Cu alloy are investigated by mathematical calculation based on Fick’s law, and the experimental verification by the thermal diffusion of the gradient Cu-Ti film was undertaken under different temperatures and durations. The results show that the layered structure of the fabricated coating is dependent on the Cu-Ti atom concentration, the increasing time and the temperature, where a single or stratified layer is formed due to the generated Cu-Ti intermetallics for the inter-diffusion between the Cu and Ti atoms. The atom distribution by the proposed simulation method based on Fick’s law corresponds to the experimental results, which can be applied to designing the structure of the modification layer.

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Electromigration behavior of Cu/Sn3.0Ag0.5Cu/Cu ball grid array solder joints

Jiang

Chen

et al. 2019

J Mater Sci: Mater Electron

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Dynamical IMC-growth calculation

Cited by 7 publications

References 9 publications

Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints

Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints

Cross-Sectional Profile Evolution of Cu-Ti Gradient Films on C17200 Cu by Vacuum Thermal Diffusion

Electromigration behavior of Cu/Sn3.0Ag0.5Cu/Cu ball grid array solder joints

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