from the plasma decomposition of hydrocarbons are known to produce temperature stable materials even when grown at room temperature [ 18 ] which compares to equivalent siliconceramic materials deposited from silane precursors, which require signifi cantly higher deposition temperatures. It is believed that when using hydrocarbons, the plasma is able to provide the carbon radicals with suffi cient electronic excitation energy, to allow the growth of high quality material despite the use of signifi cantly lower growth temperatures, [ 19 ] such as room temperature in this study. The materials formed are stable, and offer functionalities that have wide applicability. In this work, we use this ability to prove the deposition of PLC dielectric fi lms with suffi ciently low defect densities that enable their use for high-quality and electronic-grade gate dielectric layers, even when deposited at room temperature. This low-cost and toxicfree PLC material shows outstanding surface and electrical characteristics, highly suitable for electronic devices. We report for the fi rst time PLC material used as the gate dielectric layer in OTFTs with solution-processed organic semiconductor. The fabricated bottom-gate bottom-contact OTFTs with PLC dielectric present promising overall performance. The capability of PLC for room temperature deposition by well-established and industry-standard PECVD techniques renders it a highly promising gate dielectric material for wide implementation in plastic electronics.The schematic diagram of the PECVD process for PLC dielectric is shown in Figure 1 ; a water-cooling system was used to maintain the substrate at room temperature. We have considered both physical and chemical effects from the plasma on the dielectric, in order to determine the conditions for minimal plasma damage. From a physical perspective, we minimize ion-induced damage by placing the substrates on the earthed electrode of a capacitively coupled RF plasma. We also operate in a relatively high-pressure regime of 900 mTorr, where the mean free path (<<1 mm) is signifi cantly shorter than the electrode separation (8 cm).