We report on a simple, fast, and versatile bottom-up strategy based on the solid-state synthesis of interpenetrating polymer network (IPN) films by the in situ oxidative polymerization of terthiophene (3T) with Cu(ClO 4 ) 2 inside poly(methyl methacrylate) after spin-coating. Our method allows the control of the polymerization of 3T and the doping degree with the Cu(ClO 4 ) 2 /3T molar ratio. We found that the electrical conductivity and Seebeck coefficient are uncorrelated. As Cu(II)/3T ratio increases, both the conductivity and Seebeck coefficient grow. We demonstrated that the uncorrelation is due to the enhancement of the carrier mobility at the macroscopic scale as the ratio increases. The resulting IPNs show conductivities up to 20 S/cm and a Seebeck coefficient of 110 μW K −1 . The highest power factor (18 μW m −1 K −2 ) was reached for a Cu(II)/3T ratio of 2.2. This approach is fully compatible with industrial coating techniques for the large-area printing and allows very fast screening of materials and formulations to optimize thermoelectric properties.