Electrical stress on thin film TaN resistive structures

Bonfert, Detlef; Gieser, H.; Bock, Karlheinz; Sauseng, Paul; Ionescu, Ciprian

doi:10.1109/siitme.2011.6102743

Cited by 2 publications

(1 citation statement)

References 12 publications

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“…A micro-synthetic jet [14] is also based on micro heaters technology. More complicated microheaters are used for atomization of high-viscosity fluids [15] In a typical thermal inkjet arrangement, when a current is applied to the resistor for a short time (a few microseconds) [16], it heats the surrounding fluid in its immediate vicinity and causes local boiling (micro-boiling, MB). The rapid pressure rise forces liquid at a distance from the resistor into the nozzle and out of the chamber.…”

Section: Introductionmentioning

confidence: 99%

Thin-Film MEMS Resistors with Enhanced Lifetime for Thermal Inkjet

2020

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In this paper, the failure mechanisms of the thermal inkjet thin-film resistors are recognized. Additionally, designs of resistors to overcome these mechanisms are suggested and tested by simulation and experiment. The resulting resistors are shown to have improved lifetimes, spanning an order of magnitude up to 2 × 109 pulses. The thermal failure mechanisms were defined according to the electric field magnitude in three critical points—the resistor center, the resistor–conductor edge, and the resistor thermal “hot spots”. Lowering the thermal gradients between these points will lead to the improved lifetime of the resistors. Using MATLAB PDE simulations, various resistors shapes, with different electric field ratios in the hot spots, were designed and manufactured on an 8″ silicon wafer. A series of lifetime experiments were conducted on the resistors, and a strong relation between the shape and the lifetime of the resistor was found. These results have immediate ramifications regarding the different printing apparatuses which function with thermal inkjet technology, allowing the commercial production of larger thermal printheads with high MTBF rate. Such heads may fit fast and large 3D printers.

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Section: Introductionmentioning

confidence: 99%

Thin-Film MEMS Resistors with Enhanced Lifetime for Thermal Inkjet

2020

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Process Optimization of Integrated SiCr Thin-Film Resistor for High-Performance Analog Circuits

Kwon

Seol

Hong

et al. 2014

IEEE Trans. Electron Devices

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We investigated the characteristic variation of an integrated thin-film resistor (TFR), which is composed of silicon chromium (SiCr), according to process conditions and its effects on analog circuits. To improve TFR properties, such as temperature coefficient of resistance (TCR) and mismatch, the integrated TFR was examined under various process conditions. First, the sputtering power and the annealing temperature were optimized to control the TCR property. Secondly, the etching time and the dummy pattern were optimized to enhance the mismatch property. The measured TCR is −3.9 ppm/°C and the calculated mismatch slope from the standard deviation of resistance mismatch is 0.34%·µm. These results show that the fabricated TFR had near-zero TCR and a high matching constant. To verify the TFRs effects on analog circuits, low-pass filters (LPFs) were fabricated and measured as a test vehicle; the use of the optimized resistor considerably improved the performance of the resulting LPFs.Index Terms-Integrated thin-film resistor (TFR), low-pass filter (LPF), mismatch, silicon chromium (SiCr), temperature coefficient of resistance (TCR), TFR dummy pattern, TFR.

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Electrical stress on thin film TaN resistive structures

Cited by 2 publications

References 12 publications

Thin-Film MEMS Resistors with Enhanced Lifetime for Thermal Inkjet

Thin-Film MEMS Resistors with Enhanced Lifetime for Thermal Inkjet

Process Optimization of Integrated SiCr Thin-Film Resistor for High-Performance Analog Circuits

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