We
investigate hole-selective passivating contacts that consist
of an interfacial layer of silicon oxide (SiO
x
) and a layer of boron-doped SiC
x
(p). The fabrication process of these contacts involves an annealing
step at temperatures above 750 °C which crystallizes the initially
amorphous layer and diffuses dopants across the interfacial oxide
into the wafer to facilitate charge transport, but it can also disrupt
the SiO
x
layer necessary for wafer-surface
passivation. To investigate the transport mechanism of the charge
carriers through the selective contact and its changes during the
annealing process, we utilize various characterization methods, such
as transmission electron microscopy, micro Raman spectroscopy, and
conductive atomic force microscopy. Combining the latter with a sequential
removal of material, we assemble a tomographic reconstruction of the
crystallized layer that reveals the presence of preferential vertical
transport channels.