2004
DOI: 10.1016/j.jallcom.2003.11.135
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Electrical resistivity of liquid Cu–Ce alloys

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Cited by 6 publications
(2 citation statements)
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“…This assumption is supported by the results reported in [38,39], where conductivity of Cu-REM (Ce, Eu, Gd) melts was studied in the range 1200-1500 K. These studies established that higher REM content of copper alloys led to a sharp increase in resistivity at x Gd = 0.4. The increase in resistivity is evidence of lower concentration of charge carriers, which may be primarily associated with electron localization when short-range ordering like a chemical compound is established in the melts.…”
Section: Modeling Of Temperature-composition Dependence Of Thermodynasupporting
confidence: 78%
“…This assumption is supported by the results reported in [38,39], where conductivity of Cu-REM (Ce, Eu, Gd) melts was studied in the range 1200-1500 K. These studies established that higher REM content of copper alloys led to a sharp increase in resistivity at x Gd = 0.4. The increase in resistivity is evidence of lower concentration of charge carriers, which may be primarily associated with electron localization when short-range ordering like a chemical compound is established in the melts.…”
Section: Modeling Of Temperature-composition Dependence Of Thermodynasupporting
confidence: 78%
“…Over the past decades, much attention has been paid to the research of liquid-liquid structure transition (L-LST) and resistivity of liquids. [6][7][8][9][10][11] Considerable investigations reveal or indicate the existence of the L-LSTs with reversible or irreversible characters in many liquid metals and alloys. [12][13][14][15][16] Many researchers focus on the microstructure and properties of lead-free solder; however, little attention has been paid to the liquid properties of lead-free solder.…”
Section: Introductionmentioning
confidence: 99%