Electrical resistivity and creep behavior of hypoeutectic Sn–0.5Cu based solders for flip chip technology

El-Khawas, E. H.; El-Hosainy, H.; El-Daly, A.A.

doi:10.1007/s10854-017-7032-1

Cited by 6 publications

(3 citation statements)

References 18 publications

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“…This consequently leads to a reduction in electron mobility and hence increases the resistivity values. 24 Additionally, an increase in electrical resistivity of the SAC305 solder joint could be explained by microstructure changes due to the incorporation of CNT in the solder alloy. Structure properties of the solder alloys such as the type of matrix and intermetallic phase, the volume fraction of the intermetallic phase, and the sizes of intermetallic phase become the factors that may contribute to an increase in electrical resistance.…”

Section: Resultsmentioning

confidence: 99%

Electrical resistivity of Sn–3.0Ag–0.5Cu solder joint with the incorporation of carbon nanotubes

Ismail

Jalar

Atiqah

et al. 2021

Nanomaterials and Nanotechnology

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The main objective of this study is to investigate the electrical properties of Sn–3.0Ag–0.5Cu solder joint with the incorporation of carbon nanotube instead of solder bulk. Sn–3.0Ag–0.5Cu solder paste with the incorporation of carbon nanotube up to 0.04 wt% was fabricated by using mechanical mixing method. Fabricated solder pastes were then soldered on printed circuit board via reflow soldering at 260°C peak temperature. Electrical resistivity of Sn–3.0Ag–0.5Cu-carbon nanotube solder joints was measured by the four-point probe method at room temperature. Microstructure properties were observed by optical microscope and field emission scanning electron microscope. Electrical resistivity of Sn–3.0Ag–0.5Cu solder joint was found to increase with the incorporation carbon nanotube up to 0.03 wt% and slightly decrease at 0.04 wt%. Incorporation of carbon nanotube in the solder matrix apparently changes the microstructure of Sn–Ag–Cu solder alloys. Microstructural observation found that electrical resistivity correlated with the distribution area of eutectic phase in the solder matrix due to the existence of carbon nanotube. It was revealed that eutectic phase area increases with the increasing of carbon nanotube wt% up to 0.03 and then slightly decreases at the incorporation of 0.04 wt% carbon nanotube as parallel with the trend of electrical resistivity values.

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Section: Resultsmentioning

confidence: 99%

Electrical resistivity of Sn–3.0Ag–0.5Cu solder joint with the incorporation of carbon nanotubes

Ismail

Jalar

Atiqah

et al. 2021

Nanomaterials and Nanotechnology

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“…Also, this type of experiment can be applied as a non-destructive technique for prediction of the solder joint´s end-of-life. Besides that, change of electrical resistivity of the solder joint on different surfaces is also studied in this work [13][14][15][16][17].…”

Section: Introductionmentioning

confidence: 99%

Influence of Multiple Reflows and Surface Finishes on Solder Joint Resistivity

Dzivy,

Pietrikova,

Vrublevskaya

et al. 2021

Acta Electrotechnica Et Informatica

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The main purpose of this paper is the analysis of the electrical resistivity of solder joints depending on various surface finishes and on the number of reflow processes. The electrical resistivity was determined after 1, 2, 3, 5 and 6 reflow cycles as a replacement for the basic accelerated aging test. In this article, various surface finishes are compared by measuring electrical resistivity of solder joints between two soldering pads. The influence of standard surface finishes (ENIG, Lead HASL, Lead-free HASL, Cu, ImSn) with the new developed surface finish based on SnAg7 is also compared. Measurements show that the electrical resistivity is dependent on surface finish type and the thickness of the solder joint. The results prove that the new developed surface finish based on SnAg7 is stable against multiple reflows and comparable to the surface finish based on Au. The new developed surface finish based on SnAg7 can be recommended as a replacement for other conventional surface finishes.

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“…Zn 2+ dilution in ferrites appears to change both electric and magnetic properties, and promotes densification as well as grain growth [5,6]. Ahmed et al [7] reported that the dielectric behavior of Mn-Zn ferrite varied with sintering temperature. Mostly, in Mn-Zn ferrite, Mn-cations reside on both A and B sites [8], which makes it a partially inverse spinel.…”

Section: Introductionmentioning

confidence: 99%

Laser induced adjustment of the conductivity of rare earth doped Mn-Zn nanoferrite

El-Dek

Ahmed

Eltawil

2017

Materials Science-Poland

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Two series of Mn-Zn nanoferrites (namely Mn 1−x Zn x Fe 2 O 4 and Mn 1−x Zn x Fe 2−y R y O 4 ) were synthesized using standard ceramic technique. X-ray diffraction and FT-IR were employed in the chacterization of the nanopowder. The X-ray density for each sample increased after laser irradiation which was correlated with the decrease in the unit cell volume. The study involved the thermal and frequency variation of the dielectric constant and AC conductivity of the investigated samples before and after laser irradiation. The later altered the conductivity by decreasing its value for the rare earth doped samples except for the Sm 3+ doped one. The results suggested the exploitation of Mn-Zn doped rare earth nanoferrites in many technological applications demanding high resistivity.

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Electrical resistivity and creep behavior of hypoeutectic Sn–0.5Cu based solders for flip chip technology

Cited by 6 publications

References 18 publications

Electrical resistivity of Sn–3.0Ag–0.5Cu solder joint with the incorporation of carbon nanotubes

Electrical resistivity of Sn–3.0Ag–0.5Cu solder joint with the incorporation of carbon nanotubes

Influence of Multiple Reflows and Surface Finishes on Solder Joint Resistivity

Laser induced adjustment of the conductivity of rare earth doped Mn-Zn nanoferrite

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