1998
DOI: 10.1007/s11664-998-0123-2
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Electrical properties at p-ZnSe/metal interfaces

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1998
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“…In addition, reactions between p-ZnSe and metals upon annealing at elevated temperatures reduced the net acceptor concentrations, N A -N D , in the p-ZnSe epilayer close to the contact interface, which was a big disadvantage to prepare low resistance ohmic contact materials to pZnSe. 4 The most possible way to prepare ohmic contacts to p-ZnSe is to reduce significantly the SBH by fabricating an intermediate semiconductor layer between the p-ZnSe and the metal. This technique was first invented by Woodall et al 5 to prepare in-situ ohmic contacts to n-GaAs.…”
Section: Introductionmentioning
confidence: 99%
“…In addition, reactions between p-ZnSe and metals upon annealing at elevated temperatures reduced the net acceptor concentrations, N A -N D , in the p-ZnSe epilayer close to the contact interface, which was a big disadvantage to prepare low resistance ohmic contact materials to pZnSe. 4 The most possible way to prepare ohmic contacts to p-ZnSe is to reduce significantly the SBH by fabricating an intermediate semiconductor layer between the p-ZnSe and the metal. This technique was first invented by Woodall et al 5 to prepare in-situ ohmic contacts to n-GaAs.…”
Section: Introductionmentioning
confidence: 99%