2015
DOI: 10.1063/1.4906060
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Electrical performance of phase change memory cells with Ge3Sb2Te6 deposited by molecular beam epitaxy

Abstract: Here, we report on the electrical characterization of phase change memory cells containing a Ge3Sb2Te6 (GST) alloy grown in its crystalline form by Molecular Beam Epitaxy (MBE). It is found that the high temperature growth on the amorphous substrate results in a polycrystalline film exhibiting a rough surface with a grain size of approximately 80–150 nm. A detailed electrical characterization has been performed, including I-V characteristic curves, programming curves, set operation performance, crystallization… Show more

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Cited by 18 publications
(17 citation statements)
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“…6. Such a delamination was not observed for polycrystalline GST 21 or superlattices with a bad out-of-plane alignment, such as in Fig. 3(a).…”
Section: Delaminationmentioning
confidence: 90%
See 1 more Smart Citation
“…6. Such a delamination was not observed for polycrystalline GST 21 or superlattices with a bad out-of-plane alignment, such as in Fig. 3(a).…”
Section: Delaminationmentioning
confidence: 90%
“…Carbon films with a thickness of 30 nm grown on top of Si (0 0 1) by means of sputtering at room temperature and devices structure with a SiO 2 surface (details of the devices structures are described elsewhere 21 ) were used as substrates in this study. Prior to the growth the substrates were cleaned using acetone, iso-propanol and deionized water.…”
Section: Methodsmentioning
confidence: 99%
“…These problems are addressed in the present work, where the previously found switching models of CSL are challenged and an alternative ground state structure is presented. By using highly controlled Molecular Beam Epitaxy (MBE), which has shown in our previous work to produce high-quality Sb 2 Te 3 15 and GeTe 16 thin films and GeSbTe memory devices, 18 [GeTe(1 nm)-Sb 2 Te 3 (3 nm)] 15 superlattices have been grown on the Sb-passivated surfaces of Si(111), (√3 × √3)R30°-Sb, at a substrate temperature of 230°C as described in Experimental. The crystal structure of the films is resolved using various characterization techniques, including X-Ray Diffraction (XRD), Energy Dispersive X-ray spectroscopy (EDX) and High-Angle Annular Dark Field Scanning Transmission Electron Microscopy (HAADF-STEM).…”
Section: Introductionmentioning
confidence: 99%
“…[http://dx.doi.org/10.1063/1.4963889] Phase change materials (PCM) are employed in non volatile memory devices due to their fast switching between a high-resistance amorphous (a-) and a low-resistance crystalline (c-) phase. [1][2][3][4] In electrical memories, the switching process is achieved by the application of electrical pulses (nanosecond range). 2,5 The threshold switching, which is occurring in the a-phase and prior to the a-to c-phase transition, is governed by electron-phonon coupling and relaxation processes occurring on the timescale of several hundred femtoseconds (fs).…”
mentioning
confidence: 99%