2020 IEEE 70th Electronic Components and Technology Conference (ECTC) 2020
DOI: 10.1109/ectc32862.2020.00251
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Electrical Isolation Performance of Microgasket Technology for Implant Packaging

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Cited by 4 publications
(2 citation statements)
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“…This approach compromises remateability. Insulating gaskets to realize remateable connectors between areaarray ceramic feedthroughs and flexible microelectrode arrays was recently reported [25]. To allow remateability between metallic surfaces while not compromising on hermeticity and biocompatibility, nanoscale metal foams are considered to create a gasket clamp acting as a hermetic remateable seal.…”
Section: Z-elastomer Area-array Remateable Connectormentioning
confidence: 99%
“…This approach compromises remateability. Insulating gaskets to realize remateable connectors between areaarray ceramic feedthroughs and flexible microelectrode arrays was recently reported [25]. To allow remateability between metallic surfaces while not compromising on hermeticity and biocompatibility, nanoscale metal foams are considered to create a gasket clamp acting as a hermetic remateable seal.…”
Section: Z-elastomer Area-array Remateable Connectormentioning
confidence: 99%
“…Elaborado con base en: Bespalov y Selishchev (2021); Salani, Roy y Fissell (2018) (*) Nota: requiere un suministro de energía externo del tipo descrito en Khan, Pavuluri, Cummins & Desmulliez,(2020). El embalaje del tipo descrito enRustogi & Judy (2020) y la implantación como se describe en Watanabe & Miki (2019) son importantes.…”
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