Electrical Interconnect Design Optimization for Fully Embedded Board-level Optical Interconnects

Chai, J.; Yap, Guan Jie; Lim, Teck Guan; Tan, Chee Wei; Khoo, Yee Mong; Teo, Chek Sing; Lim, Li Shiah; Yee, Hong Lor; Ramana, P.V.; Lau, John H.; Chang, Richard; Tang, Tom; Chang, Hwan‐You; Chiang, S.C.L.; Cheng, David; Tseng, T.J.

doi:10.1109/eptc.2008.4763580

Cited by 4 publications

(2 citation statements)

References 7 publications

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“…It is even better to stack up a few chips (in three dimensions) on the board to enhance performance and save more cost and realestate [5]. In order to make super-thin and super-light products, e.g., mobile phones, the waveguide [6][7][8] and chips should be embedded in the optical PCB, which is the focus of this investigation.…”

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confidence: 99%

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Embedded 3D Hybrid IC Integration System-in-Package (SiP) for Opto-Electronic Interconnects in Organic Substrates

Lau

Zhang

Lee

2010

Volume 4: Electronics and Photonics

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A low-cost (with bare chips) and high (optical, electrical, thermal, and mechanical) performance optoelectronic system embedded into a PCB (printed circuit board) or an organic laminated substrate is designed and described. This system consists of a rigid PCB (or a substrate) with an embedded optical polymer waveguide, an embedded vertical cavity surface emitted laser (VCSEL), an embedded driver chip, an embedded serializer, an embedded photo-diode detector, an embedded tans-impedance amplifier (TIA), an embedded deserializer, embedded heat slugs, and a heat spreader. The bare VCSEL, driver chip, and serializer chip are 3D stacked and then attached on one end of the embedded optical polymer waveguide in the PCB. Similarly, the bare photo-diode detector, TIA chip, and deserializer chip are 3D stacked and then attached on the other end of the embedded optical polymer waveguide in PCB. The back-side of the driver or serializer and the TIA or deserializer chips is attached to a heat slug with or w/o a spreader. This novel structural design offers potential solutions for low-cost and high-performance semiconductor circuits with optical devices to realize widebandwidth and low-profile optoelectronic packaging for chipto-chip optical interconnect applications. Optical, thermal management, and mechanical performances are demonstrated by simulations based on optic theory, heat-transfer theory, and continuum mechanics.(1) IntroductionThe major trend in the optoelectronic industry today is to make products more personal by making them smarter, lighter, smaller, thinner, shorter, and faster, while at the same time making them more friendly, functional, powerful, reliable, robust, innovative, creative, and economical [1, 2]. As the

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“…Because the devices in the 3D stacking system are made with different materials, the stresses due to the thermal expansion mismatch among various parts of the system have been determined [5]. Figure 3 shows a single channel OECB with embedded waveguide using traditional PCB manufacturing process [6][7][8].…”

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confidence: 99%