Electrical conductivity of poly (L lactic acid) and poly (3-hydroxybutyrate) composites filled with galvanostatically produced copper powder

Janković, Zoran; Pavlović, Miroslav M.; Pantovic-Pavlovic, Marijana; Nikolić, Nebojša D.; Zecevic, Vladan; Pavlović, Marko

doi:10.2298/hemind180530020j

Cited by 5 publications

(2 citation statements)

References 25 publications

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“…The second peak at wavenumber 1185 cm -1 indicates the presence of a C-O group and a C-H group seen at wavenumber 738.82 cm -1 . The fourth peak at wavenumber 486.36 cm -1 indicates the presence of the Cu-O functional group [24]- [26]. There is a Cu-O bond group, and carbon functional groups dominate other functional groups.…”

Section: Testingmentioning

confidence: 99%

Comparative Study of Novelty Thin-films for Li-ion Batteries

Ikhsanudin

2022

ESTA

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The development of Li-ion batteries leads to high-density Li-ion battery technology as a storage system. to realize a Li-ion battery with a high energy density is to modify its anode, called a thin-film anode. The anode used is coated with a material thickness of 10 mm, increasing the cathode material that can be accommodated in one cell. This study aimed to analyze the Cu-powder and LTO materials used in Thin-film Li-ion batteries as a substitute for graphite because they offer higher capacity, chemical stability, fast charging technology (LTO), cheap, and environmentally friendly (Cu-powder). Based on XRD and FTIR tests, the material has a good crystal structure, and not many impurities are still contained in it. The SEM results showed that both particles showed uniformity in the shape of a single particle and were strengthened by the SEM-EDX test to review the quantity of each element present in the two materials. The electrochemical test results showed that Cu-powder material was better, with a specific capacity of 144.82 mAh g-1, higher than LTO (81.04 mAh g-1).

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Section: Testingmentioning

confidence: 99%

Comparative Study of Novelty Thin-films for Li-ion Batteries

Ikhsanudin

2022

ESTA

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“…[ 1–3 ] As a result, polymer composite is one of the options to boost thermal conductivity of polymers. Many high thermally conductive fillers, such as metals, [ 4–8 ] ceramics, [ 9–25 ] nanophase material, [ 26–33 ] and others, can be included in polymer‐matrices for this purpose. However, many fields of engineering are interested in polymer composites filled with conductive metal particles.…”

Section: Introductionmentioning

confidence: 99%

Thermo‐mechanical properties of flexible and rigid polyurethane (PU)/Cu composites

2022

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In this article, flexible and rigid polyurethane (PU)/copper (Cu) composites are prepared via a simple and cost-effective solution casting process. The filler dispersion and chemical bonding of composites are investigated by SEM and FTIR techniques. The results showed the homogeneous dispersion of Cu microparticles. Furthermore, thermal properties are investigated using DMA, DSC, and thermal conductivity measurements. The maximum improvement in thermal conductivity for flexible and rigid PU composites is 24%, and 48%, respectively, as compared to their pure counterparts. The obtained thermal conductivity values are also compared and analyzed with the mechanical property model (Corans and Patel model) and found in good agreement with the output of the model. DMA results showed enhancement in the storage modulus with filler loading while the DSC results revealed the endothermic temperature did not significantly change with adding Cu filler in both flexible and rigid PU matrices. The mechanical properties of composites were studied using tensile and hardness (Shore A and Shore D) test. For flexible PU composites an improvement in tensile strength (43%), Young's modulus (111%), Shore A hardness (6%), Shore D hardness (27%) as compared to pure flexible PU. For rigid PU composites a reduction in tensile strength (23%), Young's modulus (32%), and an increase in Shore A hardness (3%), Shore D hardness (5%) as compared to pure rigid PU. As a result of the current study, TC of rigid PU is found doubly enhanced compared to flexible PU at the same filler concentration. Copper microparticles can act as active filler in both flexible and rigid PU matrices.

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