2007
DOI: 10.1016/s1003-6326(07)60102-2
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Electrical conductivity of Cu-Ag in situ filamentary composites

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Cited by 14 publications
(14 citation statements)
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“…The electrical properties of the alloy increase as the alloy component is removed from the matrix. Therefore, the combination of precipitation hardening and strain hardening of Cu-Ag alloys may consequently lead to obtaining a material with very high mechanical and electrical properties [19][20][21]. Such features of Cu-Ag alloys may be used to obtain wires characterized by a set of very high mechanical and the requisite electrical properties required for electrotechnical applications [22].…”
Section: Introductionmentioning
confidence: 99%
“…The electrical properties of the alloy increase as the alloy component is removed from the matrix. Therefore, the combination of precipitation hardening and strain hardening of Cu-Ag alloys may consequently lead to obtaining a material with very high mechanical and electrical properties [19][20][21]. Such features of Cu-Ag alloys may be used to obtain wires characterized by a set of very high mechanical and the requisite electrical properties required for electrotechnical applications [22].…”
Section: Introductionmentioning
confidence: 99%
“…The largest number of research results were published in Japan (Oshaki, Yamazaki, Hono, Shibata, Arai, Watanabe, Asano, Kiyoshi), China (Zhang, Ning, Meng, Liu, Tian), and South Korea (Hoon Cho, Byoung-Soo Lee, Bok-Hyun Kang, Ki-Young Kim, Choi, Kwon), where virtually 80% of all available works come from. The other research centres are located mainly in the US (Han, Vasquez, Kalu, Hong, Ceylan, Sheng, Campbell), Canada (Hill, Wood, Embury), Germany (Mattissen, Heringhaus, Grunberger, Heilmaier, Schultz), Belgium (Frings, Bockstal), Switzerland (Benghalem, Morris), Russia (Gaganov, Nikulin, Vorobieva, Shokov, Pantsyrnyj), and Sweden (Fredrikson, Haddad-Sabsevar) [1][2][3][4][5][6][7][8]. The latest publications are from the previous two months of the current year.…”
Section: Introductionmentioning
confidence: 99%
“…With the rapid development in the electronic industries, the Cu-Ag alloy has been applied to many fields such as microelectronics, transportation, aerospace and mechanical manufacturing, and because of its excellent strength and electrical conductivity, has been the preferred conductor material in products such as the medical equipment, the contact wire of the high-speed train, the strong magnetic field system and the lead frame of the large scale integrated circuit [1][2][3] . But there is a waxing and waning relationship between strength and conductivity of the Cu-Ag alloy; therefore it is a key research and development direction for researchers to solve the contradictory relationship and to find a kind of material with both of high strength and high conductivity and a preparation technique [3] .…”
mentioning
confidence: 99%
“…In the past forty years, the size of the Cu-Ag alloy in-situ composites with the fibrous microstructure has been down to nanometer through cold-working such as rolling, drawing and forging, and owing to the great compatibility between Cu phase and Ag phase, the strength of mixture is usually more than the theoretical estimate value [2,4] . In addition, severe plastic deformation (SPD), such as equal channel angular pressing (ECAP), high-pressure torsion (HPT), and accumulative roll bonding (ARB), due to the simple process and low cost, has been recognized as one of the most promising technology by international researchers [5][6][7] .…”
mentioning
confidence: 99%