2013 IEEE 39th Photovoltaic Specialists Conference (PVSC) 2013
DOI: 10.1109/pvsc.2013.6744350
|View full text |Cite
|
Sign up to set email alerts
|

Electrical characterization and aging of CdTe thin film solar cells with Bi<inf>2</inf>Te<inf>3</inf> back contact

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1

Citation Types

0
8
0

Year Published

2016
2016
2022
2022

Publication Types

Select...
5
2

Relationship

2
5

Authors

Journals

citations
Cited by 10 publications
(8 citation statements)
references
References 7 publications
0
8
0
Order By: Relevance
“…Then, all the stacked layers are treated at 670 K in a chlorine-containing atmosphere with a new method described in the "the chlorine treatment" session of this paper. Finally, the device is completed by depositing the back-contact, consisting of two layers: a 150 nm thick M 2 Te 3 film (M = Sb, As, Bi), covered by a 150 nm thick Mo film [22,23]. These layers are both deposited by DC sputtering.…”
Section: The Solar Cellmentioning
confidence: 99%
“…Then, all the stacked layers are treated at 670 K in a chlorine-containing atmosphere with a new method described in the "the chlorine treatment" session of this paper. Finally, the device is completed by depositing the back-contact, consisting of two layers: a 150 nm thick M 2 Te 3 film (M = Sb, As, Bi), covered by a 150 nm thick Mo film [22,23]. These layers are both deposited by DC sputtering.…”
Section: The Solar Cellmentioning
confidence: 99%
“…This produces a “p + ” layer at the near back surface which allows carriers to tunnel through the barrier . The mechanism of Cu doping for CdTe has been widely studied and utilized in a variety of manners such as via simple copper evaporation or via inclusion in buffer layers at the back surface …”
Section: Introductionmentioning
confidence: 99%
“…Cu has previously been detected at the CdTe/CdS interface and at the CdS/CdTe junction forming recombination centres and shunt pathways . For this reason, different approaches have been applied to stabilize Cu at the back contact: such as the formation of Cu x Te compounds by CdTe etching and subsequent Cu deposition, or the use of buffer layers such as As 2 Te 3 and Bi 2 Te 3 in order to avoid copper diffusion, or the development of a ZnTe:Cu back contact …”
Section: Introductionmentioning
confidence: 99%
“…and Myers (2015)112 measured a valence band offset of 0.22 eV for the Bi 2 Te 3 /CdTe (111) interface. Romeo et al (2013)113 used Bi 2 Te 3 as a back contact material achieving 10.2% PCE (V oc 775 mV, J sc 22.9 mA cm −2 , and FF 57.5%). Tang et al (2014)114 reported similar PCE and FF values, with a lower V oc .Romeo et al (2017) …”
mentioning
confidence: 99%