2020
DOI: 10.1007/s10854-020-03322-w
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Electrical characteristics of atomic layer deposited Au/Ti/HfO2/n-GaAs MIS diodes in the wide temperature range

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Cited by 29 publications
(22 citation statements)
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“…A * value obtained from the temperature dependence of the I − V characteristics may be affected by the lateral inhomogeneity of the barrier, and the fact that it is different from the theoretical value may be connected to a value of the real effective mass that is different from the calculated one. Therefore, these undesirable findings clearly indicate the deviation from pure TE current mechanism and hence further investigations are required to understand the observed behavior [15,61,[71][72][73]77,96,153,[180][181][182].…”
Section: The Dependence Of Current-voltage Characteristics On Measurementioning
confidence: 99%
See 3 more Smart Citations
“…A * value obtained from the temperature dependence of the I − V characteristics may be affected by the lateral inhomogeneity of the barrier, and the fact that it is different from the theoretical value may be connected to a value of the real effective mass that is different from the calculated one. Therefore, these undesirable findings clearly indicate the deviation from pure TE current mechanism and hence further investigations are required to understand the observed behavior [15,61,[71][72][73]77,96,153,[180][181][182].…”
Section: The Dependence Of Current-voltage Characteristics On Measurementioning
confidence: 99%
“…The current transport mechanism across MS contact depends on the ideality of the fabricated MS junction, and it is determined from the electrical measurements with sample temperature. To fully understand the electrical properties and behavior of a SBD , the experimental electrical measurements must be taken at different sample temperatures and the characteristic diode parameters must be evaluated from these measurements [15][16][17][18][19][20][21].…”
Section: Introductionmentioning
confidence: 99%
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“…It is well known that the high density of interface states prevent for a long time a fabrication of field effect devices based on III-V semiconductor compounds in 90s. However, since the beginning of the twenty-first century, renewed interest in such devices has been observed [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15]. It is associated with the development of new passivation technologies, the construction of new metal-insulator-semiconductor field effect transistors (MISFET), and a number of issues related to silicon device scaling [16][17][18].…”
Section: Introductionmentioning
confidence: 99%