Electrical characteristics for Sn-Ag-Cu solder bump with Ti/Ni/Cu under-bump metallization after temperature cycling tests

Shih, T. I.; Lin, Yung-Chi; Duh, Jenq‐Gong; Hsu, Tom

doi:10.1007/s11664-006-0156-3

Cited by 15 publications

(8 citation statements)

References 18 publications

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“…Defects in microelectronic packages have a serious influence on device reliability [1]- [3]. The common nondestructive evaluation methods for microdefect detection include X-ray [4]- [8], infrared thermography [9], [10], vibration analysis [11], [12], and acoustic micro-imaging (AMI) [13]- [15].…”

Section: Introductionmentioning

confidence: 99%

Simulation and Experimental Verification of Edge Blurring Phenomenon in Microdefect Inspection Based on High-Frequency Ultrasound

et al. 2019

IEEE Access

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Acoustic micro-imaging based on high-frequency ultrasound has been widely and effectively used for microdefect detection in microelectronic packages. With the miniaturization of microelectronic devices and the reduction of defects, edge blurring occurs in high-frequency ultrasonic scanning and directly affects the detection accuracy and signal-to-noise ratio, especially in spherical structures, such as ball grid arrays, wafer-level chip-scale packaging, and flip-chip solder bumps. This paper depicts the ultrasound interaction behaviors and the edge blurring effects during microdefect imaging, which provide a theoretical basis for improving the defect detection accuracy in subsequent research. A microdefect finite-element model was developed to simulate scanning in acoustic microscopy imaging. C-lines and C-scans of microdefects of various sizes were obtained, which can identify the location and size of the defects more easily. Furthermore, an improved method to obtain the acoustic propagation path map was developed for analyzing the acoustic energy transmission during detection. Different energy consumption paths around the microdefect lead to differences among the C-lines. The different sizes of microdefects show different blurred edges in the C-scans. The experimental data and simulation show consistent results, which prove the credibility of the developed method. INDEX TERMS Microdefects, acoustic micro-imaging, edge blurring, acoustic propagation map.

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Section: Introductionmentioning

confidence: 99%

Simulation and Experimental Verification of Edge Blurring Phenomenon in Microdefect Inspection Based on High-Frequency Ultrasound

et al. 2019

IEEE Access

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“…Sn‐Ag‐Cu (SAC) alloys are used in solder applications, printed circuit boards, and dental fillings . Historically, 63%Sn‐37%Pb alloy was extensively used in the microelectronics industry .…”

Section: Introductionmentioning

confidence: 99%

Flame synthesis of mixed tin‐silver‐copper nanopowders and conductive coatings

Sharma

Buchner

et al. 2015

AIChE Journal

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The single-step direct synthesis of tin-silver-copper nanopowders and nanostructured coatings using the flame-based high-temperature reducing jet (HTRJ) process is reported. Nanostructured coatings were deposited and sintered within the HTRJ reactor to study the effect of reductive sintering temperature on their electrical conductivity and surface morphology. Although the ultimate application of these nanoparticles is in printed electronics, which requires dispersing them as stable inks before depositing and sintering them, our approach of direct deposition from the gas phase provides an upper limit on the conductivity achievable with a given composition. The directly deposited coatings had high electrical conductivity, including a value of 2 3 10 6 S/m for 36 wt % Cu-40 wt % Ag-24 wt % Sn sintered at 2008C. This is twice the conductivity of a pure silver coating prepared under similar conditions. Moreover, similarly high electrical conductivity was achieved using only 20% Ag with sintering at 3008C. V C 2015 American Institute of Chemical Engineers AIChE J, 62: 408-414, 2016

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“…Electrical testing measures the changes in electrical resistance and impedance to inspect the solder joints [4]. Probes are contacted with the pre-designed test pads and small electrical impulses are passed through chips to check each solder joint.…”

Section: Introductionmentioning

confidence: 99%