Electrical and mechanical package design for 4.5kV ultra high power IEGT with 6kA turn-off capability

Omura, Ichiro; Domon, T.; Miyake, Eitaro; Sakiyama, Yoko; Ogura, T.; Hiyoshi, Michiaki; Yamano, N.; Ohashi, Hiromichi

doi:10.1109/ispsd.2003.1225243

Cited by 9 publications

(1 citation statement)

References 2 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Therefore, PPIs have been developed in recent years to replace thyristors and gate turn-off thyristors (GTOs) in traction systems [53], [54], large motor drives [55]- [57], power systems [58]- [60], and pulsed power applications [61]. The reliability record for press-pack devices is much higher than power modules largely due to a better tolerance to thermal cycling: the press pack allows double-sided cooling to lower the thermal impedance [56], [62].…”

Section: Package-related Failure Mechanismsmentioning

confidence: 99%

Condition Monitoring for Device Reliability in Power Electronic Converters: A Review

Yang

Xiang

Bryant

et al. 2010

IEEE Trans. Power Electron.

986

348

View full text Add to dashboard Cite

Condition monitoring (CM) has already been proven to be a cost effective means of enhancing reliability and improving customer service in power equipment, such as transformers and rotating electrical machinery. CM for power semiconductor devices in power electronic converters is at a more embryonic stage; however, as progress is made in understanding semiconductor device failure modes, appropriate sensor technologies, and signal processing techniques, this situation will rapidly improve. This technical review is carried out with the aim of describing the current state of the art in CM research for power electronics. Reliability models for power electronics, including dominant failure mechanisms of devices are described first. This is followed by a description of recently proposed CM techniques. The benefits and limitations of these techniques are then discussed. It is intended that this review will provide the basis for future developments in power electronics CM.

show abstract