Elasto-Plastic Analysis of the Peel Test for Thin Film Adhesion

Abstract

Analyses have been made to extract the objective interfacial fracture toughness from the peel strength of very thin metallic films. An elastoplastic bending model of the adherend film has been employed in the analyses applying the fracture mechanics concept of steady-state interfacial crack growth. The analytic result finally shown is a universal peel diagram where the objective interfacial fracture toughness is readily readable when the peel strength is known. Experimental results for Cu films on Si and polyimide substrate systems with a Cr interface are also presented.

Inverse analysis determining interfacial properties between metal film and ceramic substrate with an adhesive layer

“…So an appropriate method is needed to determine 0 when the film deforms plastically [1,3,[8][9][10]15,[19][20][21][22][23][24]. In order to determine 0 by using the peel test, a beam bending model was adopted in the previous methods [1,3,[8][9][10]15,[19][20][21][22][23][24]. However, this model is only suitable for the cases of the thick film and the weak interface adhesion [22].…”

Modeling nonlinear peeling of ductile thin films??critical assessment of analytical bending models using FE simulations

“…2(c) corresponds to a model based on taking the interfacial adhesion toughness C 0 and the crack tip critical slope angle h c tip as the governing parameters for describing the peeling process. This characterization was first adopted by Kim and his coworkers (see Kim and Aravas, 1988;Kim et al, 1989). Fig.…”

“…Since this point is near the crack tip of the order O(d c ), one can consider the point B on the crack tip point in order to simplify the analysis. Kim and Aravas (1988) discussed the moment-curvature relations for reverse bending and the second unloading step. Since the equations were too complicated, they only studied the elastic-perfectly plastic case.…”

“…The plastic dissipation increases the exerted peel force in order to allow the thin film delamination. In order to model the increase of the energy release rate (or peeling force) due to plastic dissipation, Kim and his coworkers (Kim and Aravas, 1988;Kim et al, 1989) presented a plastic bending model to predict the plastic dissipation of ductile thin films. In the decade following that with most analyses on ductile thin film peeling adopted or referred to this bending model (Kinloch et al, 1994;Moidu et al, 1998;Park and Yu, 1998;Yang et al, 1999).…”

“…The detailed solutions are solved for each double-parameter criterion. The characterization of both the interfacial adhesion toughness and the crack tip slope angle adopted by Kim and his collaborators (see Kim and Aravas, 1988;Kim et al, 1989) is only one of the three criteria in the present research. By analysis and comparing the bending model results with those based on the finite element analysis model from Wei and Hutchinson (1998), the connection between two model solutions is presented.…”