Elastic and elastoplastic response of thin copper foil

Merchant, H. D.; Khatibi, Golta; Weiß, B.

doi:10.1023/b:jmsc.0000033395.87373.ea

Cited by 23 publications

(21 citation statements)

References 20 publications

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“…It has been reported [11,34] that the elastic modulus of copper thin films is significantly influenced by fabrication method, film thickness and microstructure, and is below the bulk published value of 125 GPa [35] or 117 GPa [36]. Table is the elastic modulus measured under elastically cyclic loading, which will be described later.…”

Section: Tensile Test Results and Discussionmentioning

confidence: 99%

Fatigue life and plastic deformation behavior of electrodeposited copper thin films

Huang

Song

2010

Materials Science and Engineering: A

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Section: Tensile Test Results and Discussionmentioning

confidence: 99%

Fatigue life and plastic deformation behavior of electrodeposited copper thin films

Huang

Song

2010

Materials Science and Engineering: A

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“…Figures 2(a) and 2(b) show that elongation of the E-Cu foils was larger than those of R-Cu foils. Table 2 shows that the elastic moduli of all CCC foils were much different from that of bulk copper (for bulk Cu, a value in the range 110-126 GPa is usually as assumed in [19,22]). According to Mechant et al 22,23 , differences in texture explain variations in experimentally determined elastic moduli from 68 GPa up to 132 GPa.…”

Section: Crystalline Structure and Surface Morphology Characterizationsmentioning

confidence: 99%

Mechanical properties of commercial copper current-collector foils

2014

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The functionality and reliability of the current collector (CC) are crucial to design and fabricate electrodes for Li-ion batteries because the CC serves as the bridge between external electronic and internal Li-ion transports. Therefore, understanding the mechanical behavior of CCs is of great importance for battery design and manufacturing. In this paper, we report the measured values of the elastic moduli of six commercial copper current-collector (CCC) foils. Measurements were performed using three techniques: a standard microtensile testing machine equipped with a laser sensor, dynamic mechanical analysis (DMA), and nanoindentation. For electrolytic copper (E-Cu) foils, we find elastic moduli of approximately 70 GPa, and for rolled copper (R-Cu) foils, we find elastic moduli of approximately 50 GPa. Values for yield strength and fracture strength of the foils were determined from load-deflection curves; the results are consistent with values recommended by the manufacturer. Crystalline structures, which influence values for the elastic moduli of the foils, were investigated by X-ray diffraction. Surface morphologies of the foils before testing and the fracture morphologies after testing were studied by scanning electron microscopy. Figure 4 Yield strength of CCC foils as a function of thickness Figure 5 Fracture strength of CCC foils as a function of thickness. The inset is the real picture of sample after microtensile test.

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“…In the Hall-Petch relation, the yield stress of a given metal material is proportional to d −1/2 , where d is its average grain size [31]. Merchant et al [32] has reported that the fine grain size Cu foils have relatively large elastic modulus and yield stress at room temperature.…”

Section: Tablementioning

confidence: 99%