Elastic and Conformable Electronic Circuits and Assemblies using MID in polymer

Axisa, Fabrice; Brosteaux, Dominique; Leersnyder, Eva De; Bossuyt, Frederick; González, Mario; Bulcke, Mathieu Vanden; Vanfleteren, Jan

doi:10.1109/polytr.2007.4339183

Cited by 26 publications

(23 citation statements)

References 7 publications

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“…[67] A different, but related type of stretchable electrode involves S-shaped serpentine patterns of metal lines fabricated on a carrier wafer and then embedded in PDMS by encapsulation and transfer. [55][56][57][58][59]61] Deformations of these initially planar structures occur primarily at the curved edges of the serpentines, to accommodate applied strain (e.g., Fig. 3c).…”

Section: Stretchable Metal Interconnects Between Rigid Devicesmentioning

confidence: 99%

Stretchable, Curvilinear Electronics Based on Inorganic Materials

et al. 2010

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All commercial forms of electronic/optoelectronic technologies use planar, rigid substrates. Device possibilities that exploit bio-inspired designs or require intimate integration with the human body demand curvilinear shapes and/or elastic responses to large strain deformations. This article reviews progress in research designed to accomplish these outcomes with established, high-performance inorganic electronic materials and modest modifications to conventional, planar processing techniques. We outline the most well developed strategies and illustrate their use in demonstrator devices that exploit unique combinations of shape, mechanical properties and electronic performance. We conclude with an outlook on the challenges and opportunities for this emerging area of materials science and engineering.

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Section: Stretchable Metal Interconnects Between Rigid Devicesmentioning

confidence: 99%

Stretchable, Curvilinear Electronics Based on Inorganic Materials

et al. 2010

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“…Depending on the desired metal track dimensions, it is possible to use either a Mould Interconnect Device (MID) technology [16], [17], or use a standard thin film technology at wafer level [18]. In the first case, the metal meanders are formed either by using electroplating, photolithography and wet etching or laser patterning [19].…”

Section: Stretchable Electronicmentioning

confidence: 99%

Thermo-mechanical analysis of flexible and stretchable systems

González

Vandevelde

Christiaens

et al. 2010

2010 11th International Thermal, Mechanical &Amp; Multi-Physics Simulation, and Experiments in Microelectronics and Microsystem

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This paper presents a summary of the modeling and technology developed for flexible and stretchable electronics. The integration of ultra thin dies at package level, with thickness in the range of 20 to 30 µm, into flexible and/or stretchable materials are demonstrated as well as the design and reliability test of stretchable metal interconnections at board level are analyzed by both experiments and finite element modeling. These technologies can achieve mechanically bendable and stretchable subsystems.The base substrate used for the fabrication of flexible circuits is a uniform polyimide layer, while silicones materials are preferred for the stretchable circuits. The method developed for chip embedding and interconnections is named Ultra Thin Chip Package (UTCP). Extensions of this technology can be achieved by stacking and embedding thin dies in polyimide, providing large benefits in electrical performance and still allowing some mechanical flexibility. These flexible circuits can be converted into stretchable circuits by replacing the relatively rigid polyimide by a soft and elastic silicone material. We have shown through finite element modeling and experimental validation that an appropriate thermo mechanical design is necessary to achieve mechanically reliable circuits and thermally optimized packages.

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“…Conductive adhesives were widely used to form the circuit paths on polymer substrates [4] ; traditional lithography is applied to fabricate circuit paths on polymer substrates [5] . Three dimensional circuit boards based on Molded Interconnection Devices (3D MID) technology were developed by the processes of 2K shot injection molding technology [6] and laser direct structuring technology [7] ; circuit pattern can also be replicated onto flat polymer films [8,9] . In this paper a process is introduced which allows fabrication of flexible electronic boards from thin polymer films by ultrasonic embossing and welding, and an approach for assembling and electrical interconnecting of SMDs is proposed to form a flexible electronic board.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of polymer electronic boards by ultrasonic embossing and welding

et al. 2013

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Dawei. (2015) Fabrication of polymer electronic boards by ultrasonic embossing and welding. Microsystem Technologies, 21 (2). pp. 365-369. Permanent WRAP url:http://wrap.warwick.ac.uk/76434 Copyright and reuse:The Warwick Research Archive Portal (WRAP) makes this work of researchers of the University of Warwick available open access under the following conditions. Copyright © and all moral rights to the version of the paper presented here belong to the individual author(s) and/or other copyright owners. To the extent reasonable and practicable the material made available in WRAP has been checked for eligibility before being made available.Copies of full items can be used for personal research or study, educational, or not-forprofit purposes without prior permission or charge. Provided that the authors, title and full bibliographic details are credited, a hyperlink and/or URL is given for the original metadata page and the content is not changed in any way. Publisher statement: © Cui, Liangyu, Gerhardy, Christof, Schomburg, Werner K., Tian, Yanling and Zhang, Dawei. This is the author's version of the work. It is posted here for your personal use. Not for redistribution. The definitive version was published in ACM Microsystem Technologies http://dx.doi.org/10.1007/s00542-013-2018-2 A note on versions:The version presented here may differ from the published version or, version of record, if you wish to cite this item you are advised to consult the publisher's version. Please see the 'permanent WRAP url' above for details on accessing the published version and note that access may require a subscription. Abstract: A method has been developed allowing fabrication of electronic boards from flexible polymer film by ultrasonic embossing and welding within seconds. A commercially available ultrasonic welding machine and micro patterned tools from aluminum are employed first to generate conductor paths on a flexible polymer film, in a further step, surface mounted devices (SMDs) are assembled and fixed on the flexible polymer film by a lid, and meanwhile electrical connected via a z axis conductive tape, both the molding of the lid and the bonding between the lid and electronic boards are implemented on an ultrasonic welding machine. Finally, the effectiveness of electrical interconnection is investigated at elevated temperature, humidity and bending load, exemplified by three simple circuit boards assembled with LEDs and resistors and capacitor separately, and the experimental results show that the electrical interconnection is effective, stable, and durable.

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Elastic and Conformable Electronic Circuits and Assemblies using MID in polymer

Cited by 26 publications

References 7 publications

Stretchable, Curvilinear Electronics Based on Inorganic Materials

Stretchable, Curvilinear Electronics Based on Inorganic Materials

Thermo-mechanical analysis of flexible and stretchable systems

Fabrication of polymer electronic boards by ultrasonic embossing and welding

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