Strong
electromagnetic and heat flux stresses can induce severe
damage to solid insulation materials, leading to faults in power equipment
and power electronics devices. However, in the absence of suitable
in situ imaging methods for observing the development and morphology
of electrical damage within insulation materials, the mechanism of
insulation failure under high-frequency electric fields has remained
elusive. In this work, a recently discovered fluorescence self-excitation
phenomenon in electrical damage channels of polymers is used as the
basis for a laser confocal imaging method that is able to realize
three-dimensional (3D) in situ imaging of electrical tree channels
in silicone gel through nondestructive means. Based on the reconstructed
morphology of the damaged area, a spatial equivalent calculation model
is proposed for analysis of the 3D geometric features of electrical
trees. The insulation failure mechanism of silicone gel under electric
fields of different frequencies is analyzed through ReaxFF molecular
dynamics simulations of the thermal cracking process. This work provides
a new method for in situ nondestructive 3D imaging of micro/nanoscale
damage structures within polymers with potential applications to material
analysis and defect diagnosis.