2013
DOI: 10.1002/pat.3090
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Efficient thermal properties enhancement to hyperbranched aromatic polyamide grafted aluminum nitride in epoxy composites

Abstract: Aluminum nitride (AlN) nanoparticles were firstly treated with a silane coupling agent, γ‐aminopropyl‐triethoxysilane (γ‐APS), to introduce amine groups (AlN‐APS), then grafting of the hyperbranched aromatic polyamide started from the modified surface (AlN‐HBP). The surface modified AlN nanoparticles were characterized by Fourier transform infrared, nuclear magnetic resonance, and thermogravimetric analyzer. Then the nanoparticles with these three different interface structures were selected as reinforcing fil… Show more

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Cited by 33 publications
(33 citation statements)
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“…Previous reports and our studies all show that the addition of inorganic filler (such as boron nitride, Alumina, Grphene and Nanodiamond, aluminum nitride, Boron Nitride Nanotube, Graphene Nanoplatelets and Carbon Nanotubes and so on) into polymer matrix with formation of polymer‐inorganic composites has been proved to be an efficient way to enhance the thermal conductivity of polymer–inorganic filler composite. But the dispersion of the filling phase and the interfacial adhesion between various composite components plays important role in influencing the thermal conductivity property of the composite.…”
Section: Introductionsupporting
confidence: 58%
“…Previous reports and our studies all show that the addition of inorganic filler (such as boron nitride, Alumina, Grphene and Nanodiamond, aluminum nitride, Boron Nitride Nanotube, Graphene Nanoplatelets and Carbon Nanotubes and so on) into polymer matrix with formation of polymer‐inorganic composites has been proved to be an efficient way to enhance the thermal conductivity of polymer–inorganic filler composite. But the dispersion of the filling phase and the interfacial adhesion between various composite components plays important role in influencing the thermal conductivity property of the composite.…”
Section: Introductionsupporting
confidence: 58%
“…Epoxy resins are widely applied in the aerospace, automotive and electronic industries for supporting and adhesive, owing to their excellent mechanical properties, thermal stability, and chemical resistances 2, 3 . However, intrinsic low thermal conductivity of neat epoxy resins (only the order of 0.10 Wm −1  K −1 at room temperature) 4 limits their applications 5 . In order to overcome this problem, a variety of methods have been developed to improve the thermal conductivity.…”
Section: Introductionmentioning
confidence: 99%
“…Heat dissipation through transparent optical parts in electronic devices can suggest new approaches in heat management filed. Incorporation of thermally-conductive micro size ceramics such as silicon carbide, Aluminum Nitride, Boron nitride (BN) and Al 2 O 3 to polymeric matrix can enhance thermal conductivity [2][3][4][5][6][7][8][9][10]. Incorporation of high filler contents of these micro type fillers to get moderate heat dissipation is usual.…”
Section: Introductionmentioning
confidence: 99%