2007
DOI: 10.1016/j.microrel.2006.10.004
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Effects of width scaling and layout variation on dual damascene copper interconnect electromigration

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Cited by 22 publications
(16 citation statements)
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“…Using eqns (8) and (12), it is now a simple matter to reinterpret the results of references [3,[5][6][7][8][9][10][11][12][13][14]. [5][6][7][8] (jL) Fig.…”
Section: Resultsmentioning
confidence: 99%
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“…Using eqns (8) and (12), it is now a simple matter to reinterpret the results of references [3,[5][6][7][8][9][10][11][12][13][14]. [5][6][7][8] (jL) Fig.…”
Section: Resultsmentioning
confidence: 99%
“…This case, which is valid for unpassivated lines [4], has also been used consistently in the case of passivated lines [3,[5][6][7][8][9][10][11][12][13][14]. In passivated lines, unless the anode is steadily leaking copper into the surrounding dielectric stack, the steady-state occurs only when 0  drift v .…”
Section: Introductionmentioning
confidence: 96%
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