Abstract:This letter investigates the effects of the underfill on the wideband flip-chip packaging for 5G millimeter-wave (mm-Wave) applications. For accurate interconnect design, a new hybrid equivalent circuit model is proposed. Targeting at the phased array systems with high density I/Os, a compact anti-pad structure is implemented and co-designed with the high impedance transmission line and the low-cost 90 μm solder balls, compensating the flip-chip capacitive parasitics and realizing the compact low-loss intercon… Show more
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