Effects of Tin Concentration on the Electrical Properties of Room-Temperature Ion-Beam-Assisted-Evaporation-Deposited Indium Oxide Thin Films

Abstract

Tin-doped indium oxide (ITO) thin films were deposited at room temperature by a dual-oxygen-ion-beam-assisted evaporator system and the effects of doped tin concentrations in the films on the electrical properties of the ITO films were investigated. Doped tin atoms in amorphous ITO films caused extra scattering and structural defects due to the inactivation of tin atoms in the films. Therefore, increasing the tin concentration decreased the conductivity. The lowest resistivity of indium oxide (IO) and ITO obtained was 3.6 × 10 −4-cm for IO and 4 × 10 −4-7 × 10 −4-cm for 5-25 wt% SnO 2. The mobility and mean free path of these films were 20-63 cm 2 /V•s and 3.3-7.4 nm, respectively.

Effects of Substrate Temperature on Properties of Tin-Doped Indium Oxide Films Deposited by Activated Electron Beam Evaporation

“…The decrease in carrier mobility may originate from various scattering mechanisms. 12) In the case of ITO, the scattering can be classified as (1) ionized impurity scattering, (2) neutral impurity scattering, (3) grain-boundary scattering, or (4) lattice scattering. Of these, lattice scattering (4) is not the major scattering mechanism at low temperatures.…”

Nanoimprint Mold for 2.5 Tbit/in.2 Directed Self-Assembly Bit Patterned Media with Phase Servo Pattern

“…[25][26][27][28][29][30][31] We have developed a new fabrication method for BPM using NIL and a self-assembled diblock copolymer mask. [32][33][34] Figure 2 shows the scheme of the NIL process for DSA-BPM fabrication. The NIL process is composed of three main parts.…”

Optical Properties of Undoped and Indium-doped Tin Oxide Thin Films

“…Doped or undoped SnO 2 films can be prepared by many methods such as spray pyrolysis (Afify et al, 1996;Nunes, 2001;Elangovan and Ramamurthi, 2003), electron beam evaporation [Das and Banerjee, 1987;Mika et al 2004], chemical vapor deposition [Jeong-Woon Bae et al, 2002], magnetron sputtering [Lee et al], pechini method [Legnani et al, 2007]. Thermal evaporation is the most widely used technique.…”