2017 IEEE International Reliability Physics Symposium (IRPS) 2017
DOI: 10.1109/irps.2017.7936396
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Effects of thermal stress on hybrid perovskite solar cells with different encapsulation techniques

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Cited by 3 publications
(4 citation statements)
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“…In the early days of PSC research, it was not uncommon to observe a deterioration of device efficiency upon encapsulation, with the degree of deterioration dependent on material and process used, ,, although this problem can be avoided with appropriate material and method selection and appropriate implementation (such as cleaning up the edges of perovskite film, etc.). The reduction in the efficiency of encapsulated cells likely occurs due to negative effects of the outgassing of the solvent or other components used in the sealant either during curing or during thermal stress. , To select a suitable encapsulation method, it is highly desirable to observe minimal degradation of the efficiency compared to devices without encapsulation and that the reported encapsulation method has been found to be effective under rigorous stability tests, such as damp heat tests or outdoor testing.…”
Section: Encapsulation Methods and Materials For Pscsmentioning
confidence: 99%
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“…In the early days of PSC research, it was not uncommon to observe a deterioration of device efficiency upon encapsulation, with the degree of deterioration dependent on material and process used, ,, although this problem can be avoided with appropriate material and method selection and appropriate implementation (such as cleaning up the edges of perovskite film, etc.). The reduction in the efficiency of encapsulated cells likely occurs due to negative effects of the outgassing of the solvent or other components used in the sealant either during curing or during thermal stress. , To select a suitable encapsulation method, it is highly desirable to observe minimal degradation of the efficiency compared to devices without encapsulation and that the reported encapsulation method has been found to be effective under rigorous stability tests, such as damp heat tests or outdoor testing.…”
Section: Encapsulation Methods and Materials For Pscsmentioning
confidence: 99%
“…This work included not only shelf life testing but also damp heat (nonstandard conditions), and while the obtained performance under damp heat was not impressive it should be noted that this is affected by both the intrinsic stability of the device and the quality of encapsulation. Also, it has been proposed that additional edge sealing could be detrimental for the performance of devices tested at high temperatures (over 80 °C) but it improves the performance for testing at lower temperatures . However, it was also reported that when elevated temperature and humidity is combined with the illumination, edge sealing with a desiccant resulted in better performance compared to blanket sealing .…”
Section: Encapsulation Methods and Materials For Pscsmentioning
confidence: 99%
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