Effects of the thermal boundary conditions at the sidewalls upon natural convection in rectangular enclosures heated from below and cooled from above

Corcione, Massimo

doi:10.1016/s1290-0729(02)00019-4

Cited by 186 publications

(117 citation statements)

References 15 publications

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“…Figure 5 shows the streamline and isotherm contour of different aspect ratio. It can be seen that with the increase of aspect ratio, number of vorticities also increased which shows a good agreement with M. Corcione [4]. For instance, when the aspect ratio is 3.731, four vorticities appeared circulating in the middle of radial direction.…”

Section: -5supporting

confidence: 80%

“…al [3] and Corcione [4]. They noticed that the heat transfer rate from the heated or cooled sidewalls is dependent only on Rayleigh number if the cavity aspect ratios larger than a specific value.…”

Section: Nomenclaturesmentioning

confidence: 99%

“…Effect of Rayleigh Number Figure 2 shows the streamline and isotherm contour of natural convection in Cartesian coordinate [4] with polar coordinate. The presence of hot bottom and cold top, fluid near the bottom surface is heated in the result of conduction and its density decreased and so moves up.…”

Section: -5mentioning

confidence: 99%

“…Streamline (top) and isotherm contour (bottom) for Cartesian coordinate [4] vs polar coordinate (current study). Figure 3 shows the streamline and isotherm contour for different Rayleigh number at AR =1.178.…”

Section: -5mentioning

confidence: 99%

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Natural convection in polar enclosure heated from below and cooled from above

Rasih¹,

Halmy²,

Alias³

et al. 2016

AIP Conference Proceedings

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Section: -5supporting

confidence: 80%

Section: Nomenclaturesmentioning

confidence: 99%

Section: -5mentioning

confidence: 99%

Section: -5mentioning

confidence: 99%

See 2 more Smart Citations

Natural convection in polar enclosure heated from below and cooled from above

Rasih¹,

Halmy²,

Alias³

et al. 2016

AIP Conference Proceedings

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“…Numerical studies of natural convection heat transfer and flow in closed enclosures without a local heat source are reported in the literature; we can cite the work of Davis (1983), Hortmann et al (1990), Le Quéré (1991), Mohamad (1998), Corcione (2003), and Ben-Nakhi and Chamkha (2006).…”

Section: Introductionmentioning

confidence: 99%

Natural convection heat transfer in partially open enclosures containing an internal local heat source

Mariani

Coelho

2007

Braz. J. Chem. Eng.

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-A numerical study was conducted to investigate steady heat transfer and flow phenomena of natural convection of air in enclosures, with three aspect ratios (H/W = 1, 2, and 4), within which there is a local heat source on the bottom wall at three different positions, W h . This heat source occupies 1% of the total volume of the enclosure. The vertical walls in the enclosures are insulated and there is an opening on the right wall. The natural convection is influenced by the difference in temperature between the left and right walls, represented by a Rayleigh number (Ra e ), and by local heat source, represented by a Rayleigh number (Ra i ). Numerical simulations were performed for several values of the Rayleigh number ranging between 10 3 and 10 6 , while the intensity of the two effects -the difference in temperature on the vertical walls and the local heat source -was evaluated based on the Ra i /Ra e ratio in the range between 0 and 2500. The analysis proceeds by observing variations in the streamlines and isotherms with respect to the different Ra e , R ratios, aspect ratios, of the radius and positions of the local heat source. The average Nusselt numbers on the hot and cold walls are influenced by different values of the parameters R, Ra e , W h , and H/W. Results show the presence of different flow patterns in the enclosures studied. Thus, the flow and heat transfer can be controlled by external heating, and local heat source.

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A three‐dimensional CFD and experimental study to optimize naturally air‐cooled electronic equipment enclosure: Effects of inlet height, heat source position, and buoyancy on mean rise in temperature

Riaz

Basit

Ibrahim

et al. 2017

Asia-Pacific J Chem Eng

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The major reason behind failure of electronic components is the rise in temperature. To optimize design of naturally cooled electronic equipment enclosure, a detailed experimental study and a computational fluid dynamics (CFD) analysis were performed. Commercially available software, ANSYS Fluent, was used for CFD analysis. The three-dimensional form of Navier-Stokes equations was used to solve the problem computationally. Aluminium enclosure having dimensions of 40 cm × 40 cm × 21 cm and thermal conductivity of 210 W/m·K were manufactured for experimentation in this research study.Electronic components were modelled as constant heat flux body during experimentation and CFD analysis. Effect of heat source vertical and horizontal position, inlet height, and buoyancy effect on mean rise in temperature inside the aluminium enclosure was studied. Mean temperature inside the casing was increased by increasing either heat source height or inlet height. At the end, computational results were compared with experimental results in order to check the validity of results. Computational results were highly in accordance with experimental results, because maximum percentage difference between experimental and CFD results was less than 6%. On the basis of results obtained from experiments and simulations, the best configuration of heat source and inlet was proposed, which will provide optimum thermal performance.Numerical results of velocity and temperature inside the enclosure were plotted in the form of streamlines and isotherms. This study can be used as a fundamental step prior to designing electronic equipment enclosure. KEYWORDS computational fluid dynamics (CFD), electronic equipment cooling, heat transfer experimentation, natural convection, three-dimensional analysis, ventilated enclosure Nomenclature: T ∞ , Ambient temperature (K); h, Enthalpy value per unit volume (kJ/kg·m 3 ); g, Gravitational constant (m/s 2 ); Ra, Rayleigh number; c p , Specific heat of fluid (kJ/kg·K); Ρ, Static pressure of air (N/m 2 ); T o , Temperature of the flow (K); u i , Velocity component in the ith direction (m/s); S h , Volumetric heat generation rate (W/m 3 ); K, Wall thermal conductivity (W/m·K); , Greek symbols; β, Coefficient of thermal expansion (1/K); ρ, Density of fluid (kg/m 3 ); μ, Dynamic viscosity of fluid (kg/m·s); α, Thermal diffusivity fluid (m 2 /s); , Subscripts; ∞, Indicating the conditions at infinity; o, Indicating the operating conditions

show abstract

Effects of the thermal boundary conditions at the sidewalls upon natural convection in rectangular enclosures heated from below and cooled from above

Cited by 186 publications

References 15 publications

Natural convection in polar enclosure heated from below and cooled from above

Natural convection in polar enclosure heated from below and cooled from above

Natural convection heat transfer in partially open enclosures containing an internal local heat source

A three‐dimensional CFD and experimental study to optimize naturally air‐cooled electronic equipment enclosure: Effects of inlet height, heat source position, and buoyancy on mean rise in temperature

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