Effects of the intermetallic compound microstructure on the tensile behavior of Sn3.0Ag0.5Cu/Cu solder joint under various strain rates

An, Tong; Qin, Fei

doi:10.1016/j.microrel.2014.01.008

Cited by 94 publications

(21 citation statements)

References 21 publications

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“…It was confirmed by SEM observation that the actual bonded area on the bottom surface of the copper wire is about 1, independent of the specimen. The value of the tensile interface strength is a little high in comparison with the other results (σ f = 50 to 90 MPa) obtained for similar lead-free solders and copper [9,10], and that of the shear interface strength is lower than the previous result (τ f = 40 MPa) [11]. The constraint of plastic deformation at the bottom surface of the copper wire [12,13], the size and shape of the specimens, and the data dispersion (which will be described below) may be the reason for these differences.…”

Section: Evaluation Of Tensile and Shear Strengths Of The Copper/soldsupporting

confidence: 57%

Evaluation of Thin Copper Wire and Lead-Free Solder Joint Strength by Pullout Tests and Wire Surface Observation

et al. 2017

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Abstract:Copper wires have been attracting much attention for Large Scale Integration (LSI) bonding because of their excellent mechanical and electrical properties, in addition to their low material cost. The ends of these wires are usually joined to pads or through-holes on a printed circuit board, and lead-free soldering is one of the popular bonding methods. Since the deformation resistance of solder is lower than that of copper, especially in slow deformation due to creep, the strain tends to be increased in the solder and concentrated near the copper/solder joint interface. Thus, fracture frequently occurs at this interface and may influence the quality of the product. It is therefore important to evaluate the bonding strength of thin copper wire and lead-free solder. In this paper, pullout tests of thin copper wire from lead-free solder were carried out, and the pullout behavior of the wires was observed. The bonding strength was evaluated based on the actual bonded area on the copper wire surface. Finally, the strength of the thin copper wire/solder joint was summarized using the shear and tensile strengths of the copper/solder interface as well as the tensile strength of the copper wire.

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Section: Evaluation Of Tensile and Shear Strengths Of The Copper/soldsupporting

confidence: 57%

Evaluation of Thin Copper Wire and Lead-Free Solder Joint Strength by Pullout Tests and Wire Surface Observation

et al. 2017

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“…Kelakuan mekanik sambungan pateri adalah berkait rapat dengan kelakuan mekanik unsur tersebut. Apabila sambungan pateri didedahkan pada uji kaji seperti penuaan, mikrostruktur aloi pateri berubah dan menyebabkan perubahan dalam sifat mekanik sambungan pateri (An & Qin 2014).…”

Section: Pengenalanunclassified

Kesan Kemasan Permukaan Berbeza terhadap Sifat Mikromekanik Sambungan Pateri Sac 0307 menggunakan Pendekatan Pelekukan Nano

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Jalar²,

Ismail

2018

JSM

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“…Currently, substantial literature is available to address impacts of IMC thickness on the joint mechanical properties. The varying thickness of the IMCs was commonly achieved by adjusting the reflowing temperature or isothermal aging time [14][15][16]. Hu et al [14] studied the influences of IMC thickness on the tensile strength of Sn-based solder/Cu solder joints by changing reflow temperature.…”

Section: Introductionmentioning

confidence: 99%

IMCs Microstructure Evolution Dependence of Mechanical Properties for Ni/Sn/Ni Micro Solder-Joints

et al. 2020

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The current miniaturization trend of microelectronic devices drives the size of solder joints to continually scale down. The miniaturized joints considerably increase intermetallic compounds (IMCs) volume fraction to trigger mechanical reliability issues. This study investigated precise relationships between varying IMC volumes and mechanical properties of Ni/Sn(20μm)/Ni micro-joints. A designed method that followed the IMC volume as the only variable was used to prepare micro-joint samples with different IMC volumes. The continuously thickened Ni3Sn4 IMCs exhibited a noticeable morphology evolution from rod-like to chunky shape. The subsequent tensile tests showed unexpected tensile strength responses as increasing Ni3Sn4 volume, which was strongly associated with the Ni3Sn4 morphological evolutions. Fractographic analysis displayed that the ductile fracture dominates the 20%–40% IMC micro-joints, whereas the brittle fracture governs the 40%–80% IMC micro-joints. For the ductile fracture-dominated joints, an abnormal reduction in strength occurred as increasing IMCs volume from 20% to 40%. This is primarily due to severe stress concentrations caused by the transformed long rod-typed morphology of the Ni3Sn4. For the brittle fracture-dominated joints, the strength appeared a monotonous increase as the Ni3Sn4 volume increased. This may be attributed to the increased crack resistance resulting from continuous coarsening of the chunky Ni3Sn4 without any voids. Moreover, the finite element analysis was provided to further understand the joint failure mechanisms.

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Effects of the intermetallic compound microstructure on the tensile behavior of Sn3.0Ag0.5Cu/Cu solder joint under various strain rates

Cited by 94 publications

References 21 publications

Evaluation of Thin Copper Wire and Lead-Free Solder Joint Strength by Pullout Tests and Wire Surface Observation

Evaluation of Thin Copper Wire and Lead-Free Solder Joint Strength by Pullout Tests and Wire Surface Observation

Kesan Kemasan Permukaan Berbeza terhadap Sifat Mikromekanik Sambungan Pateri Sac 0307 menggunakan Pendekatan Pelekukan Nano

IMCs Microstructure Evolution Dependence of Mechanical Properties for Ni/Sn/Ni Micro Solder-Joints

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