Electron. Mater. Lett.
 2021
DOI: 10.1007/s13391-021-00314-8
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Effects of Sputtering Power, Working Pressure, and Electric Bias on the Deposition Behavior of Ag Films during DC Magnetron Sputtering Considering the Generation of Charged Flux

Gil Su Jang
1
,
Seon Mi Ahn
2
,
Nong‐Moon Hwang
3
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