Effects of Sn grain orientation on substrate dissolution and intermetallic precipitation in solder joints under electron current stressing

Fretting corrosion: Analysis of the failure mechanism for low voltage drives applications

“…Further, the main four atom components are plotted independently. The nickel coating is well distinguished and a diffusion between Ni and Sn can be observed, this being the intermetallic crystals Ni 3 Sn 4 already observed by other authors [9].…”

Influence of bismuth on the solidification of Sn-0.7Cu-0.05Ni-xBi/Cu joints

“…SAC or SnAg solders), where there is usually only a single nucleation event and either single grain, cyclically twinned 'beachball', or interlaced twinned structures [52,[63][64][65][66][67] and no reproducible grain orientation relative to the substrate [68]. In the case of Sn-0.7Cu-0.05Ni-xBi (x≤5) solders, this type of βSn grain texture where the c-axis of the βSn crystal is oriented horizontally might be favourable for retarding electromigration that occurs fastest along the c-direction in the βSn crystal [69,70].…”

Dominant effects of Sn orientation on serrated cathode dissolution and resulting failure in actual solder joints under electromigration

“…Such apparent randomness suggests that there must be other crucial parameters that are yet to be identified. Electron current crowding has recently been shown to be irrelevant to the development of the serrated interface [3,12]. One clue is that the serrated cathode dissolution occurs only when pure Sn or Sn-rich solder alloys are used.…”