2023
DOI: 10.1007/s10854-022-09590-y
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Effects of Sn-Ag-x leveling layers on the microstructure and shear behavior of Sn-58Bi solder joint under thermal cycling

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Cited by 2 publications
(1 citation statement)
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“…The combination of these two materials generated a CE that has a higher surface area, higher electrical conductivity, and higher catalytic activity than pure copper selenide. The combination of CuS QDs and Ti 3 C 2 results in a CE with superior conductivity and catalytic activity compared to CEs produced solely with one of these materials, as demonstrated by Zheng et al [184] The presence of a certain amount of CuS QDsR overgrown on the Ti 3 C 2 surface adversely affects QDSSC performance, owing to the phenomenon of particle agglomeration, which reduces the number of active sites exposed to the electrolyte.…”
Section: Composite Carbon-based Cementioning
confidence: 94%
“…The combination of these two materials generated a CE that has a higher surface area, higher electrical conductivity, and higher catalytic activity than pure copper selenide. The combination of CuS QDs and Ti 3 C 2 results in a CE with superior conductivity and catalytic activity compared to CEs produced solely with one of these materials, as demonstrated by Zheng et al [184] The presence of a certain amount of CuS QDsR overgrown on the Ti 3 C 2 surface adversely affects QDSSC performance, owing to the phenomenon of particle agglomeration, which reduces the number of active sites exposed to the electrolyte.…”
Section: Composite Carbon-based Cementioning
confidence: 94%